Modular mass storage system

ABSTRACT

A system for storing data includes a rack and one or more data storage modules mounted on the rack. The data storage modules may include a chassis, two or more vertically-oriented backplanes coupled to the chassis, two or more mass storage devices coupled to the backplanes, and one or more air passages extending beneath one or more of the backplanes. Each backplane is configured to preclude airflow through the backplane between opposite vertical faces and can couple mass storage devices on one or more of the opposite vertical faces. One or more of the air passages can supply an upwards-directed airflow along one of the opposite vertical faces of a backplane to remove heat from a heat producing component of a mass storage device coupled to the vertical face of the vertically-oriented backplane.

BACKGROUND

Organizations such as on-line retailers, Internet service providers,search providers, financial institutions, universities, and othercomputing-intensive organizations often conduct computer operations fromlarge scale computing facilities. Such computing facilities house andaccommodate a large amount of server, network, and computer equipment toprocess, store, and exchange data as needed to carry out anorganization's operations. Typically, a computer room of a computingfacility includes many server racks. Each server rack, in turn, includesmany servers and associated computer equipment.

Computer systems typically include a number of components that generatewaste heat. Such components include printed circuit boards, mass storagedevices, power supplies, and processors. For example, some computerswith multiple processors may generate 250 watts of waste heat. Someknown computer systems include a plurality of such larger,multiple-processor computers that are configured into rack-mountedcomponents, and then are subsequently positioned within a rack system.Some known rack systems include 40 such rack-mounted components and suchrack systems will therefore generate as much as 10 kilowatts of wasteheat. Moreover, some known data centers include a plurality of such racksystems.

Some servers include a number of hard disk drives (for example, eight ormore hard disk drives) to provide adequate data storage. Typically, thehard disk drives for servers are of a standard, off-the-shelf type.Standard, off-the-shelf hard disk drives are often a cost effectivesolution for storage needs because such hard disk drives can be obtainedat relatively low cost. Nonetheless, in server designs using suchstandard hard disk drives, the arrangement of the hard disk drives mayleave a substantial amount of wasted space in the server chassis. Thiswasted space, especially when multiplied over many servers in a rack,may result in inadequate computing or storage capacity for a system.

Hard disk drives include motors and electronic components that generateheat. Some or all of this heat must be removed from the hard disk drivesto maintain continuous operation of a server. The amount of heatgenerated by the hard disk drives within a data room may be substantial,especially if all of the hard disk drives are fully powered up at alltimes. Heat may be removed from the hard disk drives via an air flowthrough a server.

In some cases, cooling systems, including air moving systems, may beused to induce an airflow through one or more portions of a data center,including an airflow through a rack that includes various heat producingcomponents. However, some configurations of various equipment in a rack,including various servers and associated equipment, may result in someof the induced airflow through a rack bypassing one or more of the heatproducing components in the rack. In some cases, airflows bypassing oneor more various heat producing components may result in suboptimalutilization of at least some of the induced airflow to remove heat fromheat producing components in the rack, and may represent suboptimalairflow through one or more rack computing systems, including one ormore servers. Suboptimal airflow through a server may hinder heatremoval from various heat producing components in the server, includinghard disk drives, which may negatively affect server operations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A-B are each schematic diagrams illustrating a side view of datastorage subsystems in a rack system and further illustrate removal ofheat from data storage modules in the rack system according to someembodiments.

FIG. 2 is a block diagram illustrating a system, including a datacontrol module and data storage modules in a rack, according to someembodiments.

FIG. 3 illustrates a data storage module having mass storage devicesinstalled on multiple vertically-oriented backplanes according to someembodiments.

FIG. 4 illustrates a cross-sectional view of a data storage modulehaving mass storage devices installed on multiple vertically-orientedbackplanes according to some embodiments.

FIG. 5 illustrates a side view of a data storage module having massstorage devices installed on multiple vertically-oriented backplanesaccording to some embodiments.

FIG. 6A-C illustrate installing a mass storage device on a backplaneaccording to some embodiments.

FIG. 7A-C illustrate installing a mass storage device on a backplaneaccording to some embodiments.

FIG. 8A-B illustrate coupling a latch element to a mass storage deviceaccording to some embodiments.

FIG. 9 illustrates installing a mass storage device on a backplaneaccording to some embodiments.

FIG. 10 illustrates a data control module that includes a datacontroller and multiple mass storage devices coupled to one or morebackplane circuit boards according to some embodiments.

FIG. 11 illustrates a method of providing data storage that includesinstalling mass storage devices on two or more vertically-orientedbackplanes coupled to a chassis, according to some embodiments.

FIG. 12 illustrates a method of providing data storage that includesinstalling mass storage devices on a backplane, according to someembodiments.

FIG. 13 illustrates a method of uninstalling mass storage devices from abackplane, according to some embodiments.

While the invention is susceptible to various modifications andalternative forms, specific embodiments thereof are shown by way ofexample in the drawings and will herein be described in detail. Itshould be understood, however, that the drawings and detaileddescription thereto are not intended to limit the invention to theparticular form disclosed, but on the contrary, the intention is tocover all modifications, equivalents and alternatives falling within thespirit and scope of the present invention as defined by the appendedclaims. The headings used herein are for organizational purposes onlyand are not meant to be used to limit the scope of the description orthe claims. As used throughout this application, the word “may” is usedin a permissive sense (i.e., meaning having the potential to), ratherthan the mandatory sense (i.e., meaning must). Similarly, the words“include,” “including,” and “includes” mean including, but not limitedto.

DETAILED DESCRIPTION OF EMBODIMENTS

Various embodiments of computer systems, and systems and methods forperforming computing operations, are disclosed. According to oneembodiment, a system for storing data includes a rack and one or moredata storage modules mounted on the rack. The data storage modules mayinclude a chassis that at least partially encompasses a chassisinterior, two or more vertically-oriented backplanes coupled to thechassis in the chassis interior, two or more mass storage devicescoupled to separate and opposite vertical faces of at least one of thetwo or more backplanes, and one or more air passages extending beneathat least one of the backplanes from the inlet end towards the exhaustend of the chassis. The one or more air passages each supply anupwards-directed airflow along at least one of the opposite verticalfaces of a vertically-oriented backplane to remove heat from at leastone heat producing component of one or more mass storage devices coupledto the vertical face.

According to one embodiment, a data storage module includes a chassis,two or more vertically-oriented backplanes coupled to the chassis, andone or more air passages extending beneath at least one of thebackplanes from an inlet end to an exhaust end of the chassis. Thechassis at least partially encompasses a chassis interior. Each of thebackplanes precludes airflow through the respective backplane betweenopposite vertical faces and is also configured to couple with at leastone mass storage device on at least one of opposite vertical faces ofthe respective backplane. The air passages are each configured to supplyan upwards-directed airflow along at least one of the opposite verticalfaces of a backplane to remove heat from at least one heat producingcomponent of at least one mass storage device coupled to the verticalface.

According to one embodiment, a method of providing data storage includescoupling two or more vertically-oriented backplanes to a chassis in achassis interior at least partially encompassed by the chassis. Eachvertically-oriented backplane can couple with at least one mass storagedevices on at least one of opposite vertical faces backplane andpreclude airflow through the backplane between the opposite verticalfaces, such that each vertical face can direct an upwards-directedairflow along the vertical face to remove heat from at least one heatproducing component of at least one mass storage device coupled to thevertical face.

As used herein, “air handling system” means a system that provides ormoves air to, or removes air from, one or more systems or components.

As used herein, “air moving device” includes any device, element,system, or combination thereof that can move air. Examples of air movingdevices include fans, blowers, and compressed air systems.

As used herein, an “aisle” means a space next to one or more elements,devices, or racks.

As used herein, “backplane” means a plate or board to which otherelectronic components, such as mass storage devices, circuit boards, canbe mounted. In some embodiments, mass storage devices, which can includeon or more hard disk drives, are plugged into a backplane in a generallyperpendicular orientation relative to the face of the backplane. In someembodiments, a backplane includes and one or more power buses that cantransmit power to components on the backplane, and one or more databuses that can transmit data to and from components installed on thebackplane.

As used herein, “ambient” means, with respect to a system or facility,the air surrounding at least a portion of the system or facility. Forexample, with respect to a data center, ambient air may be air outsidethe data center, for example, at or near an intake hood of an airhandling system for the data center.

As used herein, a “cable” includes any cable, conduit, or line thatcarries one or more conductors and that is flexible over at least aportion of its length. A cable may include a connector portion, such asa plug, at one or more of its ends.

As used herein, “circuit board” means any board or plate that has one ormore electrical conductors transmitting power, data, or signals fromcomponents on or coupled to the circuit board to other components on theboard or to external components. In certain embodiments, a circuit boardis an epoxy glass board with one or more conductive layers therein. Acircuit board may, however, be made of any suitable combination ofmaterials.

As used herein, “chassis” means a structure or element that supportsanother element or to which other elements can be mounted. A chassis mayhave any shape or construction, including a frame, a sheet, a plate, abox, a channel, or a combination thereof. In one embodiment, a chassisis made from one or more sheet metal parts. A chassis for a computersystem may support circuit board assemblies, power supply units, datastorage devices, fans, cables, and other components of the computersystem.

As used herein, “computing” includes any operations that can beperformed by a computer, such as computation, data storage, dataretrieval, or communications.

As used herein, “computer system” includes any of various computersystems or components thereof. One example of a computer system is arack-mounted server. As used herein, the term computer is not limited tojust those integrated circuits referred to in the art as a computer, butbroadly refers to a processor, a server, a microcontroller, amicrocomputer, a programmable logic controller (PLC), an applicationspecific integrated circuit, and other programmable circuits, and theseterms are used interchangeably herein. In the various embodiments,memory may include, but is not limited to, a computer-readable medium,such as a random access memory (RAM). Alternatively, a compact disc-readonly memory (CD-ROM), a magneto-optical disk (MOD), and/or a digitalversatile disc (DVD) may also be used. Also, additional input channelsmay include computer peripherals associated with an operator interfacesuch as a mouse and a keyboard. Alternatively, other computerperipherals may also be used that may include, for example, a scanner.Furthermore, in the some embodiments, additional output channels mayinclude an operator interface monitor and/or a printer.

As used herein, “data center” includes any facility or portion of afacility in which computer operations are carried out. A data center mayinclude servers dedicated to specific functions or serving multiplefunctions. Examples of computer operations include informationprocessing, communications, testing, simulations, power distribution andcontrol, and operational control.

As used herein, “data center module” means a module that includes, or issuitable for housing and/or physically supporting, one or more computersystems that can provide computing resources for a data center.

As used herein, to “direct” air includes directing or channeling air,such as to a region or point in space. In various embodiments, airmovement for directing air may be induced by creating a high pressureregion, a low pressure region, or a combination both. For example, airmay be directed downwardly within a chassis by creating a low pressureregion at the bottom of the chassis. In some embodiments, air isdirected using vanes, panels, plates, baffles, pipes or other structuralelements.

As used herein, “member” includes a single element or a combination oftwo or more elements (for example, a member can include two or moresheet metal parts fastened to one another.

As used herein, a “module” is a component or a combination of componentsphysically coupled to one another. A module may include functionalelements and systems, such as computer systems, circuit boards, racks,blowers, ducts, and power distribution units, as well as structuralelements, such a base, frame, housing, or container.

As used herein, “mounting” a particular element on another elementrefers to positioning the particular element to be in physical contactwith the other element, such that the other element provides one or moreof structural support, positioning, structural load transfer,stabilization, shock absorption, some combination thereof, or the likewith regard to the particular element. The mounted particular elementmay be positioned to rest upon one or more upper surfaces of the otherelement, independent of coupling the elements via one or more couplingelements. In some embodiments, mounting the particular element toanother element includes coupling the elements such that the otherelement provides one or more of structural support, positioning,structural load transfer, stabilization, shock absorption, somecombination thereof, or the like with regard to the particular element.

As used herein, “installing” a particular element on another elementrefers to physically coupling the elements such that the particularelement is communicatively coupled with at least the other element.Installing the elements can include electrically coupling the elementsvia physically coupling an electrical connector of the particularelement with a complementary electrical connector of the other element.Installing a particular element to another element can includeelectrically coupling a portion of the particular element to a portionof the other element and mounting another potion of the particularelement to another portion of the other element.

As used herein, “primarily horizontal”, also interchangeably referred tohereinafter as “horizontally-oriented”, means at least more horizontalthan vertical. In the context of an installed element or device,“primarily horizontal” or “horizontally-oriented” includes an element ordevice whose installed width is greater than its installed height. Insome embodiments, a horizontally-oriented element or device is fullyhorizontal.

As used herein, “primarily vertical”, also interchangeably referred tohereinafter as “vertically-oriented”, means at least more vertical thanhorizontal. In the context of an installed element or device, “primarilyvertical” or “vertically-oriented” includes an element or device whoseinstalled height is greater than its installed width. In the context ofa hard disk drive, “primarily vertical” or “vertically-oriented”includes a hard disk drive that is installed such that the installedheight of the hard disk drive is greater than the installed width of thehard disk drive. In some embodiments, a vertically-oriented element ordevice is fully vertical.

As used herein, a “rack” means a rack, container, frame, or otherelement or combination of elements that can contain or physicallysupport one or more computer systems.

As used herein, “room” means a room or a space of a building. As usedherein, “computer room” means a room of a building in which computersystems, such as rack-mounted servers, are operated.

As used herein, a “space” means a space, area or volume.

As used herein, “shelf” means any element or combination of elements onwhich an object can be rested. A shelf may include, for example, aplate, a sheet, a tray, a disc, a block, a grid, or a box. A shelf maybe rectangular, square, round, or another shape. In some embodiments, ashelf may be one or more rails.

As used herein, “shock absorbing”, as applied to a supporting elementfor another element, means that the supporting element absorbsmechanical energy and/or at least partially mitigates shock and/orvibration loads. A shock-absorbing material may be elastic,viscoelastic, viscous, or combinations thereof.

FIG. 1A-B are each schematic diagrams illustrating a side view of datastorage subsystems in a rack system and further illustrate removal ofheat from data storage modules in the rack system according to someembodiments.

In some embodiments, a rack includes two or more data storage subsystemshaving vertically-oriented mass storage devices. FIG. 1A is a schematicdiagram illustrating a side view of three data storage subsystems 130 ina rack interior 122 of rack 120. Data storage subsystems 130 eachinclude a data control module 136 and three data storage modules 138mounted on one or more portions of the rack 120. In each of data storagesubsystems 130, data control module 136 may control, and access data on,data storage modules 138. In some embodiments, data storage modules 138include two or more horizontally-oriented backplanes carryingvertically-oriented mass storage devices, which may include one or moremass storage devices. For example, data storage modules 138 may eachinclude 6 backplanes and 16 mass storage devices arranged thereuponeach, such that each data storage module 138 includes 96 mass storagedevices. Each data storage module 138 may have a rack height of 4U, anddata control module 136 may have a rack height of 1U. As a result, therack interior 122 of rack 120 in FIG. 1A may include three subsystems130, each occupying a space of 13U in rack height for a total occupiedspace with a height of 39U in the rack interior 122 and a total numberof mass storage devices included in the three subsystems 130 of 864 massstorage devices. In various embodiments, data storage modules and datacontrol modules may be any suitable height. In various embodiments, oneor more subsystems of data control modules and data storage modules mayinclude various ratios of devices. For example, in some embodiments, adata storage subsystem may include one data control module and one datastorage module. As shown, the modules 136, 138 may not occupy theentirety of rack interior 122 space at the given elevation at which eachmodule is mounted on the rack, such that additional components may bemounted on the rack at the same given elevation, including one or moreair moving devices 126, rack-level power distribution units, etc. Insome embodiments, including the illustrated embodiment, a data controlmodule 136 may occupy a reduced length of the rack interior 122 relativeto data storage modules 138.

In some embodiments, a rack includes two or more data storage subsystemshaving horizontally-oriented oriented mass storage devices. FIG. 1B is aschematic diagram illustrating a side view of three data storagesubsystems 140 in a rack interior 122 of rack 120. Data storagesubsystems 140 each include a data control module 146 and three datastorage modules 148 mounted on one or more portions of rack 120. In eachof data storage subsystems 140, data control module 146 may control, andaccess data on, data storage modules 148. In some embodiments, datastorage modules 148 include two or more vertically-oriented backplanescarrying horizontally-oriented mass storage devices, which may includeone or more hard disk drives. One or more of the vertically-orientedbackplanes may couple with mass storage devices on each of oppositevertical faces of the backplane. For example, data storage modules 148may each include 3 vertically-oriented backplanes and 16 mass storagedevices coupled to each of two opposite vertical faces of eachbackplane, such that each data storage module 148 includes at least 96mass storage devices, similarly to data storage modules illustratedbelow with regard to FIG. 2-13. Because horizontally-oriented massstorage devices may occupy a reduced amount of vertical space relativeto vertically-oriented mass storage devices, each data storage module148 may have a rack height of 3U, compared with a 4U rack height of datastorage module 138 illustrated and discussed above with reference toFIG. 1A, and data control module 146 may have a rack height of 1U. Inaddition, each data control module 146 may include one or morevertically-oriented backplanes, to which multiple additional massstorage devices may be coupled on each of opposite vertical faces. As aresult, the rack interior 122 of rack 120 in FIG. 1B may include threesubsystems 140, each occupying a space of 13U in rack height for a totaloccupied space with a height of 39U in the rack interior 122 and a totalnumber of mass storage devices included in the data storage modules 148of the three subsystems 140 of 1152 mass storage devices. In addition,where each data control module 148 includes six additional mass storagedevices, as illustrated below with regard to FIG. 10, the rack interiorof rack 120 in FIG. 1B may include a total number of 1170 mass storagedevices using 39U of rack height. In various embodiments, one or moresubsystems of data control modules and data storage modules may includevarious ratios of devices. For example, in some embodiments, a datastorage subsystem may include one data control module and three datastorage module, and a rack may include four subsystems for a totaloccupied space with a height of 40U in the rack interior 122.

As shown, the modules 146, 148 may occupy substantially an entirety ofrack interior 122 space at the given elevation at which each module ismounted on the rack, such that certain additional components areprecluded from being mounted on the rack 120 at the same givenelevation, including one or more air moving devices external to themodules, rack-level power distribution units, etc. In some embodiments,a data control module 146 may occupy a reduced length of the rackinterior 122 relative to data storage modules 148.

As a result of the illustrated difference in total mass storage devicesincluded in racks with data storage modules having vertically-orientedmass storage devices and extending substantially entirely through agiven elevation of the rack interior, as illustrated in FIG. 1A-B, arack 102 in which subsystems of 3U data storage modules withvertically-oriented backplanes and 1U data control modules with datastorage portions, as illustrated for example below with regard to FIG.2-13, may enable a given rack interior 122 of a given height of rackspace, including 39U of rack height, to accommodate a greater number ofmass storage devices relative to a rack in which 4U data storage moduleswith horizontally-oriented backplanes and extending through a portion ofthe rack interior at a given elevation, are coupled.

FIG. 1A-B illustrate embodiments of removal of heat from data storagemodules in a rack system. In each of the illustrated embodiments, airmay flow into computing room 102 of data center 100 from sub-floorplenum 104 by way of vent 108. In some embodiments, such as illustratedin FIG. 1A, where the rack 120 includes an interior 122 into whichmultiple subsystems each comprising 4U data storage modules 138 and 1Udata control modules 136 are coupled, rear fans 126 in fan door 128 maydraw air from front aisle 112, also referred to as an “inlet” aisle,into rack 120, and through data storage modules 138 and data controlmodules 136 coupled in the rack interior 122. Rear fans 126 may exhaustheated air (“exhaust air”) out of the rack. The heated air may beexhausted into rear aisle (“exhaust aisle”) 114. The heated air may flowinto ceiling plenum 106.

In some embodiments, such as illustrated in FIG. 1B, where the rack 120includes an interior 122 into which multiple subsystems 140 eachcomprising 3U data storage modules 148 and 1U data control modules 146with data storage portions are coupled, each of the modules 146, 148 mayinclude one or more air moving devices, which may include one or morerear air fans, air blowers, etc. may draw air from front aisle 112, alsoreferred to as an “inlet” aisle and through the respective module 146,148 in which the air moving device is included. The air moving devicesmay each exhaust heated air (“exhaust air”) out of the respective module146, 148. The heated air may be exhausted into rear aisle (“exhaustaisle”) 114. The heated air may flow into ceiling plenum 106. Airdirecting device 124 is provided on the front of rack 120. Air directingdevice 124 may be used to promote airflow in particular modules mountedin the rack. Other arrangements of air movers may be included in variousembodiments. U.S. patent application Ser. No. 12/646,417, “Air DirectingDevice for Rack System”, filed Dec. 23, 2009; U.S. patent Ser. No.12/751,212, “Rack-Mounted Air Directing Device with Scoop”, filed Mar.30, 2010; and U.S. patent application Ser. No. 12/886,440, “System withRack-Mounted AC Fans”, filed Sep. 9, 2010, each of which is incorporatedby reference as if fully set forth herein, include other arrangements,systems, devices, and techniques that may be used in various embodimentsfor cooling or mounting computing modules, data storage modules and datacontrol modules.

In various embodiments, a data storage system includes one or more datastorage modules that are accessed from, and controlled by, a datacontroller external to the data storage modules. In some embodiments, adata control module and one or more data storage modules coupled to thedata control module are included within a rack. FIG. 2 is a blockdiagram illustrating a system, including a data control module and datastorage modules in a rack, according to some embodiments. System 200includes rack 202, data control module 204, and data storage modules206. Data control module 204 and data storage modules 206 are includedin rack 202.

Mass storage devices 210 in data storage modules 206 are communicativelycoupled to data control module 204. Data control module 204 may accessdata on any or all of the mass storage devices in data storage modules206 a, 206 b, and 206 c. In some embodiments, data control module 204 ismounted in an interior of one or more of the data storage modules 206.

In various embodiments, a data storage module includes two or morecircuit boards, each of which carry, and provide electrical connectionsfor, multiple mass storage devices. In some embodiments, one or more ofthe circuit boards in a data storage module are coupled to a chassis ofthe module in a primarily vertical orientation, also referred to asbeing “vertically-oriented”. For example, in the embodiment illustratedin FIG. 2, data storage module 206 includes vertically-orientedbackplane circuit board assemblies 208, also referred to herein asvertically-oriented “backplanes”. Backplanes 208 carry mass storagedevices 210. Backplanes 208 may provide power, data, and signalconnections for mass storage devices 210. In some embodiments, one ormore portions of a backplane 208, including a vertically-orientedcomponent of the backplane, is coupled with a mass storage device 210 toprovide at least some structural load support of the mass storage device210 in the data storage module 206. In various embodiments, each of massstorage devices 210 is a hard disk drive. In one embodiment, each ofmass storage devices 210 is a 4 TB hard disk drive with a Serial AdvanceTechnology Attachment (SATA) interface.

In the embodiment shown in FIG. 2, each backplane 208 carries 16 massstorage devices 210 on a face of the backplane. A backplane may,however, carry any number of mass storage devices. In some embodiments,different backplanes within a data storage module carry a differentnumber of mass storage devices. In some embodiments, one or more of thebackplanes in a data storage module carries separate mass storagedevices on separate faces of the backplane. The faces that carry massstorage devices may be opposite faces of the backplane. Where thebackplane is vertically-oriented, the backplane can, in someembodiments, carry mass storage devices on opposite vertical faces ofthe backplane. For example, in the illustrated embodiment,vertically-oriented backplanes 208 each carry 16 mass storage devices onopposite vertical faces of the respective backplane, thus carrying atotal of 32 mass storage devices per backplane. Vertical faces of abackplane may refer to faces with a surface extending along a primarilyvertical plane.

System 200 includes bus 212 a, 212 b, and 212 c. Bus 212 a couples datacontrol module 204 with data storage module 206 a. Bus 212 b couplesdata control module 204 with data storage module 206 b. Bus 212 ccouples data control module 204 with data storage module 206 c. Buses212 a, 212 b, and 212 c may each include one or more cables between datacontrol module 204 and data storage modules 206 a, 206 b, and 206 c.Each of buses 212 a, 212 b, and 212 c may provide a connection for datainput/output between data controller 204 and one of the data storagemodules. In some embodiments, each of buses 212 a, 212 b, and 212 c mayprovide for data I/O on multiple channels (for example, four channels).Each of data storage modules 206 a, 206 b, and 206 c may be assigned aseparate identifier.

In various embodiments, data access and transfer between a datacontroller and data storage modules in a system may be carried out byway of any suitable computer bus. In some embodiments, data access andtransfer is carried out by way of a Serial attached SCSI (SAS) bus. Insome embodiments, data access and transfer is carried out by way of aSerial Advance Technology Attachment (SATA) bus.

In some embodiments, connections within each of storage modules 206 a,206 b, and 206 c may include chaining backplanes within a data storagemodule. In some embodiments, connections within each of storage modules206 a, 206 b, and 206 c may include coupling backplanes with an expanderdevice within a data storage module. For example, as illustrated in FIG.2, the backplanes 208 are each coupled to bus 212 a by way of arespective connection pathway 214 to an expander device 216. Bus 212 acouples to expander device 216, such that each backplane 208 is coupledto data controller 204 via bus 212 a, expander device 216, and arespective communication pathway 214. In some embodiments, a bus 212 caninclude multiple connections to expander device 216.

In some embodiments, each of backplanes 208 includes an expander chip.The expander chip may enable communication with the various mass storagedevices 210. Each of backplanes 208 may also include a cascading portfor chaining backplanes 208 one to another. In some embodiments,backplanes 208 includes circuitry for conditioning power to mass storagedevices 210. In certain embodiments, backplanes 208 may each include apower supply for mass storage devices 210 on the backplane.

For the sake of clarity, the backplanes and mass storage devices areshown only for data storage module 206 a. The backplanes and massstorage devices for data storage modules 212 b and 212 c may be similarto those of data storage module 212 a.

Each backplane may include an output for each of the installed massstorage devices 210. In one embodiment, the data input/output interfaceto backplanes includes four channels. In one embodiment, each of massstorage devices 210 has a 500 GB storage capacity.

Although 3 modules are shown in FIG. 2, in various embodiments anynumber of data storage modules may be coupled to a data controller.

FIG. 3 illustrates a data storage module having mass storage devicesinstalled on multiple vertically-oriented backplanes according to someembodiments. System 300 includes data storage module 302. In someembodiments, data storage module 302 is mounted in a rack (not shown).

Data storage module 302 includes data storage module chassis 306, datastorage assemblies 308, and power supply unit 330. Data storageassemblies 308 include backplane circuit board assemblies 312, alsoreferred to herein as “backplanes”, and mass storage devices 314. Asshown in the illustrated embodiment, backplane circuit board assemblies312 may be mounted in a primarily vertical orientation in data storagemodule chassis 306.

In various embodiments, a chassis for a module may include, or be usedin combination with, various structural elements and components forsupport, mounting, and environmental protection of the elements of themodule, such as enclosures, mounting plates, covers, panels, or mountingrails.

Mass storage devices 314, which may include one or more hard diskdrives, are installed on backplane circuit board assemblies 312. Aninstalled mass storage device 314 may be electrically coupled to abackplane circuit board assembly 312 via coupling of one or more pairsof complementary electrical connectors of the mass storage device andthe backplane circuit board assembly, where the installed mass storagedevice is communicatively coupled to a data control module via thebackplane circuit board assembly. As shown in the illustratedembodiment, mass storage devices 314 may be installed in a primarilyhorizontal orientation. In some embodiments, mass storage devices 314are installed such that the installed length that extends perpendicularto the face of the backplane to which the respective mass storage deviceis installed is the largest dimension of the mass storage device.

In some embodiments, and as shown in FIG. 3, a backplane circuit boardassembly 312 may include a horizontally-oriented retention bar 357 thatcouples to mass storage devices 314 installed on the backplane circuitboard and secures the mass storage devices 314 from collisions, sideshock, etc.

Power supply unit 330 may be coupled to one or more of the backplanecircuit board assemblies 312. Power supply unit 330 may supply power toone or more backplane circuit board assemblies 312 and mass storagedevices 314 coupled to the one or more backplane circuit boardassemblies 312. In some embodiments, a power supply 330 is coupled to aboard that delivers power to one or more of the backplanes 312. In someembodiments, such a board includes one or more expanders, includingexpander device 216 illustrated and discussed above with reference toFIG. 2, for data connections involving one or more mass storage devices314.

In some embodiments, data storage module 302 is approximately 3U inheight. In some embodiments, data storage module 302 extends along afull depth of a rack, such that various components, including arack-level power distribution unit and air moving device, are precludedfrom being mounted in the rack interior, and external to the datastorage module chassis interior, at a common elevation with the datastorage module 302.

In some embodiments, a chassis for a module may include, or be used incombination with, various structural elements and components forsupport, mounting, and environmental protection of the elements of themodule, such as enclosures, mounting plates, covers, panels, or mountingrails. In some embodiments, the chassis at least partially encompasses achassis interior of the data storage module. In the illustratedembodiment of FIG. 3, for example, the chassis 306 encompasses bottomand side ends of the chassis interior, as well as front (“inlet”) 391and rear (“exhaust”) 393 ends, and leaves unencompassed at least the topend of the chassis interior. In some embodiments, a chassis may fullyencompass a chassis interior.

Encompassment of one or more ends of a chassis interior should beunderstood to encompass one or more structural elements substantiallybounding an end of one or more particular ends of an interior space,excepting at least particular portals that are utilized in associationwith operations of one or more components within the interior space. Forexample, a portion of chassis 306 that covers a front end of the datastorage module 302 may be understood to encompass at least the frontend, despite the presence of one or more front vents 392 in the front ofdata storage module chassis 306, as the one or more front vents 392,also referred to herein as air inlets, are understood to be associatedwith operations of one or more components within the interior space ofthe data storage module. Similarly, vents associated with power supplyunit 330, portals associated with electrical connectors, communicationpathway connectors, etc. may be discounted in considering one or moreends of an interior space to be encompassed by one or more portions of achassis.

In various embodiments, a computing unit includes a power supply thatconforms to an industry-recognized standard. In some embodiments, apower supply for a computing unit has a form factor in accordance withan industry-recognized standard. In one embodiment, power supply unit330 has a standard 1U form factor. Examples of other standards for apower supply and/or a power supply form factor include 2U, 3U, SFX, ATX,NLX, LPX, or WTX.

In the embodiment shown in FIG. 3, data storage module 302 includes onepower supply unit and further includes 96 mass storage devices. Acomputer system may, however, have any number of mass storage devices,power supply units, or other components.

In some embodiments, a data storage module 302 includes one or moreinternal air moving devices. The one or more air moving devices may becoupled to the chassis 306 of the data storage module 302 at leastpartially in a chassis interior of the chassis. For example, FIG. 3illustrates an array 372 of air moving devices 374 coupled to chassis306 at the rear end 393 of the chassis 306.

In some embodiments, one or more air moving devices induce airflowthrough an interior of a data storage module, including a chassisinterior at least partially encompassed by a chassis of the data storagemodule. The air moving devices may induce the airflow via inducing apressure difference, also referred to hereinafter as a pressuregradient, across the chassis interior. Such a pressure gradient mayresult from one or more air moving devices reducing the air pressure inthe chassis interior, increasing the air pressure in the chassisinterior, etc. Air moving devices may include air moving devices of oneor more types and configurations known to those having skill in the art,including air fans, air blowers, etc. As referred to herein, air blowersmay be distinguished from air fans as air moving devices that exhaust anairflow with a changed direction and pressure relative to an airflowreceived into the blower, and air fans may be understood to include airmoving devices that exhaust an airflow with a substantially similardirection relative to an airflow received into the fan. In theillustrated embodiment, for example, air moving devices 374 include oneor more air fans that exhaust air in a substantially similar flowdirection as the flow direction of air received into the air fans.

In the illustrated embodiment, air moving devices 374 in array 372 maydraw air from front end 391 into the chassis interior at least partiallyencompassed by chassis 306 through the front vent 392, and betweenvarious mass storage devices 314 and backplanes 312 in the chassisinterior, based on reducing air pressure on an exhaust end 393 of thechassis. The resulting pressure gradient across the chassis interior ofchassis 306 may induce an airflow through the data storage module 302from the inlet end 391 to the exhaust end 393.

In some embodiments, array 372 is a discrete cooling system thatprovides discrete cooling of the particular data storage module 302 insystem 300 to the exclusion of any other modules that may be present insystem 300. For example, where system 300 includes a rack into whichmultiple data storage modules 302 are mounted, each data storage modulemay include an array 372 of air moving devices 374 that provide coolingof components within the particular module 302 to which the devices 374are coupled, to the exclusion of components in any of the other modules302 mounted in the rack. As used hereinafter, “discrete cooling” refersto cooling of an individual “discrete” module by a particular coolingsystem, where the particular cooling system provides cooling exclusivelyto the individual discrete module. In some embodiments, a discretecooling system that provides discrete cooling of a particular datastorage module 302 includes one or more air moving devices that arecomprised in a discrete cooling module that is indirectly coupled to thechassis 306 via directly coupling with a rack to which the chassis 306is coupled. Such a discrete cooling module can include an air cover thatat least partially encompasses a portion of the chassis 306 interior, anair moving device coupled to the air cover, etc.

FIG. 4 illustrates a cross-sectional view of a data storage modulehaving mass storage devices 414 installed on multiplevertically-oriented backplanes 412, and at least one power supply unit430, according to some embodiments. In some embodiments, a data storagemodule includes one or more backplanes that are coupled to the datastorage module chassis in a primarily vertical orientation, hereinafterreferred to interchangeably as vertically-oriented backplanes coupled tothe chassis.

In some embodiments, a vertically-oriented backplane circuit boardassembly 412 may include a vertically-oriented backplane circuit board421, to which mass storage devices 414 are electrically coupled viacoupling with complementary circuit board connectors 423.Vertically-oriented backplane circuit board assemblies 412 may includeone or more horizontally-oriented mounting plates 425 upon which one ormore mass storage devices 414 are mounted, such that the mass storagedevices 414 rest on the mounting plates and transfer at least a portionof their structural load to such mounting plates. The one or morehorizontally-oriented mounting plates 425 can align a given mass storagedevice 414 with a corresponding connector. In some embodiments, and asshown in FIG. 4, a backplane circuit board assembly 412 may include ahorizontally-oriented retention bar 457 that couples to mass storagedevices 414 installed on a backplane circuit board 421 of backplanecircuit board assembly 412 and secures the mass storage devices 414 fromcollisions, side shock, etc. In some embodiments, one or morehorizontally-oriented mounting plates 422 that are separate from one ormore backplane circuit board assemblies 412 may be mounted in chassis406 and may at least partially structurally support one or more massstorage devices 414 installed on backplanes 412.

A vertically oriented backplane 412 may include a circuit board 421 withopposite vertical faces, one or both of which include connectors 423that can electrically couple the circuit board 421 with one or more massstorage devices, including mass storage devices 414, via coupling ofcomplementary electrical connectors of the mass storage devices 414 withelectrical connectors 423.

In some embodiments, each vertically-oriented backplane is comprised ofone or more components that preclude airflow through the components. Forexample, a backplane circuit board may be substantially solid inconstruction and independent of manufactured air vents in the circuitboard 421, so that air is precluded from flowing directly through thecircuit board 421 between opposite vertical faces of thevertically-oriented backplane circuit board assembly 412. As a result,where vertically-oriented backplanes 412 are coupled to a chassis in achassis interior, the vertically-oriented backplanes may at leastpartially establish vertically-oriented air passages at least partiallybounded by one or more vertical faces of the backplanes, so that atleast a portion of the vertically-oriented backplanes each direct atleast a portion of airflow along a vertical face of the backplane.

As shown in the illustrated embodiment of FIG. 4, each of thevertically-oriented backplanes 412 is independent of air vents in thecircuit boards 421 of the respective backplanes 412, and air flowingthrough the chassis interior of chassis 406, from front vent 492 at theinlet end 491 of the chassis 406, is directed into one of variousvertically-oriented air passages 401A-F bounded on one or more verticalplanes by vertical faces of one or more of the backplanes 412, verticalfaces of the chassis 406, etc. Air can be directed through the interiorof the chassis 406 to an exhaust end 493 of the chassis via one or moreair moving devices 474 in an array 472 of air moving devices.

As shown in the illustrated embodiment, some embodiments of a datastorage module 402 include one or more air passages extending beneathone or more of the vertically-oriented backplane circuit boardassemblies 412 coupled to the chassis 406. The one or more air passagesmay be established at least in part by an open space between a portionof the chassis bounding a bottom end of the chassis interior and one ormore lower ends of the backplane circuit board assemblies 412 and massstorage devices 414 coupled thereto. Air entering the chassis interiorfrom an inlet end of the chassis may be directed along the one or moreair passages beneath the backplanes 412 and may be supplied, through oneor more of the vertically-oriented passages 401A-F, in one or morevertically-directed upwards air flows across one or more of the massstorage devices 414 and vertical faces of one or more backplanes 412. Asillustrated by the flow arrows, an entirety of the air flow into thechassis interior from the front vent 492 may be directed through atleast a portion of the air passages beneath one or more of thebackplanes 412, and portions of the airflow may be supplied upwardsthrough the various vertically-oriented passages 401A-F. In someembodiments, the various upwards-directed portions of the inlet airflowflow upwards through passages 401A-F substantially in parallel with eachother, and each airflow portion removes heat from heat producingcomponents of devices bounding the respective passage 401A-F throughwhich the air passes upwards. For example, airflow portions flowingupwards through passage 401B may remove heat exclusively from massstorage devices 414 installed in the air passage 401B, relative to massstorage devices 414 installed in one of the other air passages 401A,C-F. As a result, in some embodiments, each airflow portion flowingthrough each vertically-oriented air passage 401A-F removes heat inparallel and independently of each other.

As shown by the flow arrows in the illustrated embodiment, the one ormore air passages extending beneath one or more backplanes 412 supplyupwards-directed portions of the inlet airflow from front vent 492 tothe various vertically-oriented air passages 401A-F, such that separateportions of the inlet airflow remove heat from components in separateair passages bounded by separate vertical faces of the variousbackplanes. The air passage may supply the various upwards portions ofthe airflow based at least in part upon various factors, includingimpedance of the airflow at openings to each respective air passage401A-F that diverts portions of the airflow into the respectivepassages, a chimney effect that induces a separate portion of theairflow to rise through separate openings to the separate air passages401A-F, some combination thereof, or the like.

FIG. 5 illustrates a side view of a data storage module having massstorage devices installed on multiple vertically-oriented backplanesaccording to some embodiments. Data storage module 500 includes achassis 506 that at least partially encompasses an interior of the datastorage module. The at least partially-encompassed interior is alsoreferred to hereinafter as a “chassis interior”. Various components arecoupled to the chassis in the chassis interior, including one or morepower supply units 530 and various vertically-oriented backplane circuitboard assemblies (hereinafter referred to interchangeably as“backplanes”) 512 to which mass storage devices 514 are installed oneach of opposite vertical faces of the backplanes 512.

In the illustrated embodiment, three separate vertically-orientedbackplanes 512 are coupled to the chassis 506 in the chassis interior,and each backplane is coupled with at least one mass storage device 514on each of opposite vertical faces of the backplane. In someembodiments, a backplane may be configured to couple with at least onemass storage device on a single vertical face of the backplane. In someembodiments, and as shown in the illustrated embodiment, at least somebackplanes are coupled to a chassis via one or more support posts 527that position the coupled backplane 512 in a particular position in thechassis interior, both relative to the inlet end 591 and exhaust end 593of the chassis 506 and in elevation relative to bottom and top ends ofthe chassis interior.

In some embodiments, a vertically-oriented backplane 512 includes one ormore vertically-oriented backplane circuit boards 521 and one or morehorizontally-oriented components. The vertically-oriented backplanecircuit board 521 includes the connector 523 that establishes anelectrical connection with an installed mass storage device 514. As thebackplane circuit board 521 is vertically-oriented, and a mass storagedevice 514 that is installed on the backplane 512 couples with at leastan electrical connector 523 on a vertical face of the circuit board 521,the mass storage device may be installed on the backplane 512 in ahorizontal orientation. For example, as shown in the illustratedembodiment, a mass storage device 514 installed on a vertically-orientedbackplane 512 may be oriented on its “side”, where the largest dimensionof the mass storage device 514 is the length of the device extendingsubstantially perpendicular to the plane of the vertical face of thebackplane 512 to which the mass storage device 514 is coupled viaconnector 523. As a result, a mass storage device that includes anelectrical connector for data transfer and access on a “bottom” of thedevice can be coupled to the backplane where the device is oriented onits “side” to align the “bottom” side of the device with one or moreconnectors 523 on the vertically-aligned backplane 512.

In some embodiments, including the illustrated embodiment, multiplevertically-oriented backplanes 512 are mounted in multiple locationsthrough a depth of the chassis 506. As a result, one or more sets ofmass storage devices 514 are installed on one or morevertically-oriented backplanes 512 in a location in the chassis 506 thatis adjacent to other sets of mass storage devices 514 installed on otherbackplanes 512, including the one or more mass storage devices 514installed on backplane 512 and at least partially located in passage501C, which are adjacent to mass storage devices 514 located in passages501B and 501D. In some embodiments, a mass storage device 514 installedon a backplane 512 that is adjacent to other backplanes and mass storagedevices is not adjacent to a front end 591 of the chassis 506. In someembodiments, a mass storage device 514 installed on a backplane 512 thatis adjacent to other backplanes and mass storage devices is not adjacentto a rear end 593 of the chassis 506.

In some embodiments, where a mass storage device includes one or moreelectrical connectors on its “bottom” side, the device's largestdimension may be a dimension that does not bound its “bottom” side. Forexample, in the illustrated embodiment, where a mass storage device 514is oriented on its “side” so that a connector on the “bottom” side iscoupled to a connector 523, the largest dimension may be a length of thedevice along one or more sides that extend substantially perpendicularto the “bottom” side of the mass storage device. In some embodiments, achassis with vertically-oriented backplanes that couple to devices onsides that do not include the largest dimension of the mass storagedevice, such as in the illustrated embodiment, may have a reduced heightrelative to a chassis with horizontally-oriented backplanes that coupleto mass storage devices on sides that do not include the largestdimension of the mass storage device. As a result, because a chassisincluding vertically-oriented backplanes may be shorter in height than achassis including horizontally-oriented backplanes, a given rack mayinclude a greater number of data storage modules with respective chassesincluding vertically-oriented backplanes, relative to the number of datastorage modules with respective chasses including horizontally-orientedbackplanes. As a result, such a given rack including data storagemodules with respective chasses including vertically-oriented backplanesmay include a greater number of mass storage devices, thereby includinga greater mass storage device density, than a rack including datastorage modules with respective chasses including horizontally-orientedbackplanes.

In some embodiments, where a vertically-oriented backplane 512 includesone or more horizontally-oriented components, one or more of thehorizontally-oriented components can physically couple with a massstorage device coupled to the backplane 512 to mount the mass storagedevice on the horizontally-oriented components, such that thehorizontally-oriented components include one or more structural couplingelements that couple with the mass storage device to enable one or moreof structural support, positioning, structural load transfer,stabilization, shock absorption, some combination thereof, or the likewith regard to the mass storage device, while the one or morevertically-oriented backplane circuit boards of the backplane includeone or more electrical connectors 523 that physically couple with themass storage device to electrically couple the backplane circuit boardwith the mass storage device, thereby enabling data transfer, access,storage operations, some combination thereof, or the like between themass storage device and at least the backplane circuit board. In theillustrated embodiment, for example, vertically-oriented backplane 512includes one or more vertically-oriented backplane circuit boards 521,to which mass storage devices 514 can be coupled on at least onevertical face via one or more electrical connectors 523, andhorizontally-oriented mounting plates 522, 525 and retention bar 557.The mounting plates 522, 525 may include one or more guiding elements,coupling elements, etc., as discussed and illustrated further below,that may physically couple with one or more portions of a mass storagedevice 514 to mount the mass storage device 514 on the mounting plates522, 525 to enable one or more of structural support, positioning,structural load transfer, stabilization, shock absorption, somecombination thereof, or the like with regard to the mass storage deviceand at least the mounting plates. In particular, mounting plates 522,525 may absorb some or all of the structural load of the mounted massstorage device 514 and transfer the load to the chassis 506 via one ormore posts 527.

In some embodiments, a data storage module includes one or more airpassages that extend through at least a portion of the chassis interiorof the module. Such air passages can direct and supply air betweenvarious points in the chassis interior. For example, air passages cansupply air from an ambient environment to flow in heat transfercommunication with one or more heat producing components and remove heatfrom same. In another example, air passages can remove air that hasremoved heat from one or more heat producing components, also referredto herein as exhaust air, from the chassis interior to an ambientenvironment, thereby removing the removed heat from the chassisinterior. Heat removal from heat producing components in the chassisinterior via one or more airflows allows operations utilizing suchcomponents without excessive heat buildup in the chassis interior, whichcan damage equipment.

In some embodiments, a data storage module includes one or more airpassages that extend beneath one or more vertically-oriented backplanesin the chassis interior. Such an air passage, also referred to herein asan “inlet air plenum”, can be bounded on a lower side by at least aportion of the data storage module chassis and bounded on at leastportions of an upper side by lower portions of the one or morevertically-oriented backplanes, where the lower portions of the one ormore vertically-oriented backplanes at least partially direct airflow onthe upper side of the inlet air plenum and the portion of the datastorage module chassis directs airflow on the lower side of the inletair plenum. The inlet air plenum may be in flow communication with anair inlet on an inlet end of the chassis and may extend from the inletend towards the exhaust end of the chassis. The inlet air plenum can, insome embodiments, supply air that is received through the air inlet froman ambient environment through the inlet air plenum and beneath one ormore of the backplanes. Supplying one or more airflows beneathbackplanes and from the air inlet at the inlet end towards the exhaustend can enable air to be supplied from the inlet air plenum at variouspoints in the chassis interior along at least a portion of the length ofthe chassis, from the inlet end towards the exhaust end.

For example, in the illustrated embodiment, data storage module 500includes a chassis 506 with three vertically-oriented backplane circuitboard assemblies 512, where an inlet air plenum 502 extends in a portionof the chassis interior beneath each of the three backplanes 512. Theinlet air plenum 502 also extends beneath the mass storage devices 514installed on the backplanes 512, and air being supplied through theinlet air plenum 502 from the vent 592 at the inlet end 591 towards theexhaust end 593 is not in heat transfer communication with heatproducing components in the mass storage devices 514, backplanes 512,etc. when still flowing through the plenum 502. As a result, an airflowthrough plenum 502 can be supplied, in one or more various portions ofthe airflow, to the various mass storage devices 514 without beingpreheated by other mass storage devices. Such non-preheated air suppliedfrom the plenum 502 to each of the mass storage devices 514 may have asubstantially common temperature, such that the capacity to remove heatfrom mass storage devices 514 installed on the backplane 512 that iscoupled to the chassis at a position that is most proximate to theexhaust end 593 may be similar to the capacity to remove heat from massstorage devices 514 installed on the backplane 512 that is coupled tothe chassis at a position that is most proximate to the inlet end 591.Such similar (“uniform”) heat removal capacity for mass storage devicesat various positions in the chassis interior can enable more optimaloperation capacity for mass storage devices, regardless of whichbackplane in the chassis to which the device is coupled. In someembodiments, one or more various components can be mounted at leastpartially in the inlet air plenum 502. For example, one or more of adata control module that is configured to access, control, etc. one ormore of the mass storage devices 514, one or more power supply units,some combination thereof, or the like can be mounted in plenum 502 atleast partially beneath at least one of the backplane assemblies 512.

As shown in the illustrated embodiment, in some embodiments, one or moreair gaps at an upper end of an inlet air plenum extending beneath one ormore backplanes enables a portion of the airflow through the inlet airplenum to be supplied from the plenum to flow in heat transfercommunication, and remove heat from, one or more heat producingcomponents located in one or more separate air passages. For example, asshown, where the upper boundary of the inlet air plenum 502 is at leastpartially defined by components of the vertically-oriented backplanes512 in the chassis interior, gaps between adjacent backplanes 512 canprovide portals through which a portion of the airflow through the inletair plenum 502 can be supplied. As shown in the illustrated embodiment,each gap in the upper portion of the inlet air plenum 502 may lead to aseparate one of substantially parallel air passages 501A-F through thechassis interior. In some embodiments, each air passage 501 may flow inheat transfer communication with one or more sets of heat producingcomponents of one or more mass storage devices 514. Each air passage mayextend substantially in parallel with one or more other air passagesbeing supplied with air from various air gaps to the inlet air plenum,so that air being supplied from the inlet air plenum to the passages issupplied in separate parallel portions that flow substantially inparallel through the chassis interior and remove heat from one or moreseparate sets of heat producing components.

In some embodiments, air passages that supply air from an inlet airplenum across, in heat transfer communication with, etc. one or moreheat producing components are supplied air through one or more variousmechanisms. For example, a pressure gradient may exist across an airpassage, such that air is supplied from the inlet air plenum at a higherpressure than the pressure of air exiting the air passage. In anotherexample, an air passage may extend vertically from the inlet air plenum,such that air rises from the inlet air plenum through the passages dueto the chimney effect, flow impedance, some combination thereof, etc. Inthe illustrated embodiment, for example, each air passage 501A-Fsupplied by the inlet air plenum 502 is positioned over an air gap in anupper end of the plenum 502, and respective and separate portions of theairflow through the plenum 502 rise from the plenum, through therespective gaps, and through the respective passages 501A-F. In someembodiments, each passage is at least partially bounded and defined byone or more vertical faces of one or more backplanes.

In some embodiments, each passage is at least partially bounded by oneor more vertically-oriented components separate from one or morebackplanes. For example, in the illustrated embodiment, one or morepassages 501 may be bounded by a vertical face of at least one backplane512 and one or more vertical components of chassis 506. One or morepassages may be bounded by a vertically-oriented element positioneddistal to an end of a mass storage device 514 that is coupled to avertically-oriented backplane circuit board 521. A vertical componentmay be mounted on a horizontally-oriented mounting plate 522 that isseparate from a backplane 512, where the vertical component extendsbetween at least two sets of mass storage devices 514 installed onseparate backplanes 512, where the vertical component provides aphysical barrier between at least two respective passages 501 that eachpass across respective ones of the at least two sets of mass storagedevices 514. For example, a vertical component may be mounted betweenpassages 501B and 501C, where the vertical component bounds at least aportion of each air passage 501B, 501C and air is precluded from passingbetween the two passages 501B, 501C.

For example, a vertically-oriented backplane 512 may include one or morecomponents, including vertically-oriented backplane circuit board 521,that preclude airflow though the board 521, so that air flowing througha passage 501 adjacent to that board 521 flows along the board 521 butdoes not flow through it between opposite vertical faces of the board521. As a result, air flowing through a passage 501 is directed in avertical direction through the passage by at least one vertical face ofa vertically-oriented backplane. For example, in the illustratedembodiment, each passage 501 extends adjacent to at least onevertically-oriented backplane 512, and air flowing through a respectivepassage 501 may be directed to flow upwards based at least in part uponthe adjacent backplane 512 precluding an airflow through the backplanebetween opposite vertical faces thereof.

In some embodiments, one or more air passages in a chassis interiorinclude one or more air passages that extend above one or morevertically-oriented backplanes. Such air passages, referred to herein asexhaust air plenums 503, may be supplied with air from one or more airpassages 501. As air supplied from the passages 501 may have removedheat from one or more heat producing components in heat transfercommunication with the respective passage, including one or morecomponents of a mass storage device 514 installed on a backplane suchthat the mass storage device is located at least partially in thepassage, air supplied from one or more air passages 501 may includeexhaust air. In some embodiments, the exhaust air plenum supplies air,including exhaust air, supplied from one or more air passages 501 to theexhaust end 593 of the chassis. Where an air exit is positioned at theexhaust end of the chassis, the air supplied to the exhaust end of thechassis may exit the chassis, thereby removing any removed heat from thechassis interior. In some embodiments, plenum 503 is absent from datastorage module 500, and air exiting one or more passages 501 may exitthe module 500 via one or more air conduits, passages, etc. incommunication with exits of at least one of the passages 501. Forexample, one or more air conduits in communication with the upper end ofat least one of the air passages 501 may remove exhaust air exiting theupper end of the at least one air passage 501 from the module 500.

In some embodiments, one or more of the vertically-oriented backplanescoupled to the chassis in the chassis interior, at least some of themass storage devices 514 installed on backplanes coupled to the chassis,some combination thereof, or the like are coupled in a “staggered”configuration. As used hereinafter, a “staggered” configuration ofbackplanes, mass storage devices, etc. refers to a configuration ofbackplanes, mass storage devices, etc. through a chassis interior thathave different elevations relative to one or more adjacent backplanes,mass storage devices, etc. Such differences in elevation may be partialdifferences in elevation, where the upper and lower ends of a givenbackplane may be different from corresponding upper and lower ends ofone or more adjacent backplanes, but the lower end of a given backplanemay be at a lower elevation relative to an upper end of an adjacentbackplane. A staggered configuration of backplanes can include asequence of backplanes along a length of the chassis from one end to anopposite end of the chassis, where each backplane extends substantiallyperpendicular to the length of the chassis, where each backplane in thesequence has a lower elevation in the chassis interior relative to anadjacent preceding backplane in the sequence and a higher elevation inthe chassis interior relative to an adjacent following backplane in thesequence.

In some embodiments, one or more air passages extending through at leasta portion of the chassis interior includes varying cross-sectionalareas, perpendicular to the length of the one or more air passages alongthe length of the chassis from the inlet end towards the exhaust end.The varying cross-sectional areas may be established based at least inpart upon varying elevations of one or more backplanes coupled in astaggered configuration. For example, in the illustrated embodiment,where backplanes 512 are coupled to chassis 506 in a staggeredconfiguration from the inlet end towards the exhaust end, where theinlet-proximate backplanes 512 are elevated at least partially aboveadjacent following backplanes 512, the inlet air plenum 502 extendingfrom the inlet end includes cross sectional areas, perpendicular to thedirection of flow through plenum 502 from the inlet end towards theexhaust end, that decrease from the inlet end towards the exhaust endthrough the plenum. In some embodiments, varying cross-sectional areasof one or more air passages may be established based at least in partupon varying elevations of one or more mass storage devices 514installed on backplanes 512 in the chassis 506.

The cross-sectional area of an air passage may change in a discontinuousmanner along the length of the air passage. For example, thecross-sectional area of an air passage may progressively change indiscrete steps along the length of the air passage. As shown in theillustrated embodiment, the cross-sectional area of plenum 502progressively decreases along its length from inlet end 591 towardsexhaust end 593 in discrete step changes. In addition, thecross-sectional area of plenum 503 progressively increases along itslength from inlet end 591 towards exhaust end 593 in discrete stepchanges. Based at least in part upon the varying cross-sectional areaalong a length of an air passage, the air passage may be understood to“narrow” or “expand” corresponding to respective increases or decreasesin its cross-sectional area. For example, plenum 502 progressivelynarrows along its length from the inlet end 591 towards the exhaust end593, and plenum 503 progressively expands along its length from theinlet end 591 towards the exhaust end 593.

In some embodiments, the variation of cross sectional area at particularlocations along a length of an air passage corresponds with a change inbackplane elevation. The three illustrated backplanes 512 haveprogressively reduced elevations in the chassis interior from the inletend 591 towards the exhaust end 593, and respectively installed massstorage devices 514 have correspondingly progressively reducedelevations in the chassis interior. As a result, the upper end of theplenum 502 is reduced along its length at each backplane 512 andinstalled mass storage devices 514, such that the plenum progressivelynarrows in discrete step changes corresponding to a particularrespective backplane and coupled components. In some embodiments, thevariation of cross sectional area at particular locations along a lengthof an air passage corresponds with a change in mass storage deviceelevation.

In some embodiments, a change in elevation between adjacent backplanes,mass storage devices, etc. in a chassis interior can enable a portion ofan airflow through an air passage extending beneath the backplanes to bediverted into another air passage extending between the adjacentbackplanes. Where a first backplane is at least partially elevated abovea succeeding backplane, and an air plenum passes an airflow beneath thebackplanes from under the first backplane to at least under thesucceeding backplane, at least a lower portion of the succeedingbackplane, being at a lower elevation than a corresponding lower portionof the first backplane, may extend at least partially beneath the firstbackplane, such that at least a portion of the airflow through theplenum impinges on the lower portion of the succeeding backplane. Thatportion of the airflow may be diverted by at least the lower portion ofthe succeeding backplane upwards through an air passage between thefirst and succeeding backplanes.

In some embodiments, where one or more air passages progressively narrowfrom an inlet end to an exhaust end of the chassis, the air passagesprogressively impede an airflow through the air passages from the inletend towards the exhaust end. Airflow may be progressively impededcorresponding to changes in cross-sectional area of the air passages.For example, where air plenum 502 progressively narrows from inlet end591 towards exhaust end 593, the airflow through plenum 502 may becomeprogressively more impeded, also referred to as being progressivelyimpeded, as the cross sectional area of the plenum 502 decreases alongits length. Progressive impedance of flow through the plenum 502 at eachchange in cross sectional area can divert at least a portion of theairflow in the plenum 502 to be supplied out of the plenum 502 into atleast one air passage 501. The increased impedance may create a pressuregradient that diverts air through passages with reduced relativeimpedance relative to the plenum 502 at the point of increasedimpedance.

In some embodiments, progressively increased impedance of airflowthrough the inlet air plenum 502 can enable airflow rates out of theplenum 502 through each of the air passages 501 to maintain one or moreflow properties without one or more predetermined tolerance ranges. Forexample, progressively impeding flow through the plenum 502 can enableairflow out of the plenum 502 and into passage 501F to have an airflowvelocity, air mass flow rate, air volumetric flow rate, etc. that issimilar to a corresponding flow characteristic of airflow out of theplenum 502 at a relatively less impeded location in the plenum 502 andthrough passage 501A.

In some embodiments, where the progressive narrowing of plenum 502 isestablished based at least in part upon the staggered configuration ofthe backplanes 512, the backplanes may be coupled to the chassis 506 ina staggered configuration that establishes an inlet air plenum 502 thatprogressively narrows such that airflow through the plenum isprogressively impeded along its length in the direction of flow andmaintains one or more airflow characteristics that exceed one or morepredetermined threshold values of the flow characteristics.

In some embodiments, the backplanes 512 are coupled to the chassis 506in a staggered configuration to establish air inlet and exhaust plenums,and air passages at least partially bounded by the backplanes 512, thatenable an inlet airflow received into the chassis interior from anambient environment to be supplied through a progressively-narrowedinlet air plenum beneath one or more backplanes, where separate portionsof the airflow are supplied to separately remove heat from separate heatproducing components coupled to separate backplanes. The airflow throughthe inlet air plenum may comprise a laterally-directed airflow. Theseparate portions of the airflow may be supplied in parallel throughseveral separate parallel air passages, such that the separate portionsof the airflow each comprises one or more upwards-directed verticalairflows. The separate portions of the airflow, in some embodiments,enter one or more exhaust air plenums subsequent to removing heat fromone or more heat producing components, and the exhaust plenum may directthe airflow, which may include exhaust air, to the exhaust end of thechassis to exit the chassis interior. The airflow through the exhaustplenum may comprise a laterally-directed airflow. In the illustratedembodiment, flow arrows illustrate a lateral flow of air through plenums502 and 503, and upwards-directed flows of separate portions of theairflow through plenum 502 through each of passages 501. Plenum 502supplies separate portions of air received from an ambient environmentat the inlet end 591 of the chassis 506 through front vent 592 to eachof the passages 501A-F, and plenum 503 supplies the separate portions ofair exiting passages 501A-F to exit the chassis interior at exhaust end593 via one or more air moving devices 574 positioned at the exhaustend.

In some embodiments, a chassis 506 has a length that extendssubstantially through an entire depth of a rack in which the datastorage module 500 is mounted. As a result, chassis 506 may havesufficient length to preclude various components from being mounted inthe rack at a common elevation with the data storage module 500. Forexample, the chassis may be sufficiently long that any remaining spacein the rack interior precludes coupling a rack-level power distributionunit to the chassis 506 in the rack interior. Similarly, the chassis maypreclude mounting an air moving device in the rack interior at a commonelevation with the data storage module 500. Where a rack comprisesmultiple such data storage modules 500, mounting of various components,including air moving devices, at any point in the rack interior may beprecluded. Such data storage modules 500 may be referred to as includingbackplanes coupled to a chassis in a full-depth configuration, where thechassis extends substantially along a full depth of the rack in which itis mounted.

In addition, in some embodiments where a data storage module 500includes a chassis 506 that extends approximately along the full depthof a rack in which the chassis 506 is mounted, various components thatmay be traditionally mounted at a common elevation with a data storagemodule in the rack are excluded from doing so. For example, a rack mayinclude a power distribution unit (PDU) door mounted on a front (inlet)end of the rack, where the PDU door includes one or more rack PDUs thatdistribute power to one or more servers in the rack via cableconnections, bus connections, etc. In addition, a rack may include a fandoor on a rear (exhaust) end of the rack, where the fan door includesone or more air moving devices, including air fans, air blowers, etc.,that move air through one or more modules mounted in the rack. In someembodiments, a full-depth data storage module may preclude suchcomponents, including PDU doors, rack PDUs, fan doors, air movingdevices, etc., from being coupled to the rack, at least at a commonelevation with the full-depth data storage module 500, because thefull-depth module 500 has sufficient chassis 506 length that theremaining space in the rack interior at a common elevation with thefull-depth module is insufficient to accommodate such other componentsvia one or more of the front end of the rack, the rear end of the rack,etc. Such components that are excluded from accommodation in the rackcan include components that provide one or more capabilities that may beshared by multiple data storage modules in a rack. For example, where arack comprises a standard 19-inch rack, as will be understood withregard to EIA-310, revision D, a full-depth data storage module includesa chassis 506 that extends approximately along a full depth of the19-inch rack, such that an insufficient amount of space within theopening of the rack, which can measure 17.72-inches in width, isavailable at a front end of the rack to accommodate a PDU that ismounted in a PDU door that, when closed, projects the PDU through thefront side of the rack towards the front side of the chassis 506, a fandoor that includes one or more air moving devices that project through arear side of the rack towards the rear side of the chassis, etc.

In some embodiments, air moving device 574 is part of a discrete coolingsystem that provides discrete cooling of the particular data storagemodule 500 to the exclusion of any other modules. For example, wheremodule 500 is mounted in a rack with multiple similar modules 500, whereeach module substantially occupies the length of the rack at a commonelevation with the respective module, each data storage module 500 mayinclude an array of air moving devices 574 that provide cooling ofcomponents within the particular module 500 to which the devices 514 arecoupled, to the exclusion of components in any of the other modules 500mounted in the rack.

In some embodiments, air moving devices 574 are coupled to a chassis 506proximate to an exhaust end 593 of the chassis at least partially in thechassis interior. An air moving device 574 coupled to the chassisproximate to an exhaust end can induce airflow through the chassisinterior, which can include some or all of airflow through the plenum502, passages 501A-F, and plenum 503 and may be referred collectively toas “chassis airflow”. The air moving device 574 may move air out of thechassis interior to reduce the air pressure in at least a portion of thechassis interior relative to the ambient environment proximate to theinlet end. As a result, a pressure gradient from the ambient environmentto the air moving device may be established, which may induce some orall of the chassis airflow.

In some embodiments, one or more of the air moving devices 574 are atleast partially adjustable with regard to orientation. An air movingdevice may include one or more actuators that can operate to change therelative orientation of the air moving device 574 relative to thechassis 506. The actuator may be commanded to change the relativeorientation by one or more controller devices, which may command theorientation change based at least in part upon one or morecharacteristics associated with the chassis airflow. The characteristicsmay include one or more of air temperature, air pressure, mass flowrate, volumetric flow rate, flow velocity, some combination thereof, orthe like at one or more positions within or outside of the chassisinterior of data storage module 500.

FIG. 6A-C and FIG. 7A-C illustrate installing a mass storage device on abackplane according to some embodiments. In some embodiments, massstorage device 602 is coupled to a connector 612 on a vertical face of avertically-oriented backplane circuit board 610.

In some embodiments, a mass storage device is electrically coupled to avertically-oriented backplane circuit board based at least in part uponbeing mounted on one or more mounting plates to align an electricalconnector of the mass storage device to physically couple with acomplementary connector of the vertically-oriented backplane circuitboard. One or more mounting plates, retention bars, some combinationthereof, or the like may be coupled to the mass storage device to securethe device in a particular position. As a result, the device may beisolated from collisions with other components, side-shocks, etc. basedat least in part upon the mounting plates, retention bars, and couplingelements thereto.

As shown in FIGS. 6A and 7A, a mass storage device 602 may include atleast two lower coupling elements 608, 609 which can fit intocorresponding keyhole slots 605, 607 on mounting plates 604, 606 tomount the mass storage device 602 on the mounting plates 604, 606. Oneor more of coupling elements 608, 609 may include one or more isolationdamping shoulder screws. In some embodiments, placing the mass storagedevice 602 on the mounting plates 604, 606 to insert the couplingelements 608, 609 into the corresponding keyhole slots 605, 607 will atleast partially align an electrical connector of the mass storage device(not shown) with a corresponding electrical connector 612 on avertically-oriented backplane circuit board 610 that is adjacent to themounting plates 604, 606. Inserting the coupling elements 608, 609 intothe corresponding keyhole slots 605, 607 may align the constraininglatch rail 622 of the constraining latch 620 with a latch interface 626,which may include a slot into which the latch element can engage. Themass storage device 602 may include a constraining latch 620, whichincludes a latch rail 622 with latch element 627 and release tab 624.The mass storage device 602 may include an upper coupling element 630,which may include one or more isolation damping shoulder screws.

As shown in FIGS. 6B and 7B, the mass storage device 602, mounted onmounting plates 604, 606 via inserting the lower coupling elements 608,609 of the mass storage device 602 into corresponding keyhole slots 605,607, can be slid along upper surfaces of one or more of mounting plates604, 606 towards the electrical connector 612 to couple an electricalconnector of the mass storage device 602 (not shown) with thecomplementary electrical connector 612, thereby electrically couplingthe mass storage device 602 with the vertically-oriented backplanecircuit board 610. In some embodiments, including the illustratedembodiment, the keyhole slots 605, 607 to which coupling elements 608,609 of mass storage device 602 are inserted include narrowing portionsthat narrow towards the backplane circuit board 610 on each mountingplate, such that the coupling elements 608, 609 can be slid at leastpartially through the corresponding keyhole slot narrowing portions asthe mass storage device 602 is slid toward the electrical connector 612.In certain embodiments, sliding coupling elements 608, 609 at leastpartially through the corresponding keyhole slot narrowing portionssecures the coupling elements 608, 609 from being decoupled from thekeyhole slots, thereby securing the mass storage device 602 to themounting plates 604, 606.

In some embodiments, sliding mass storage device 602 along uppersurfaces of one or more of mounting plates 604, 606 towards theelectrical connector 612 to couple an electrical connector of the massstorage device 602 (not shown) with the complementary electricalconnector 612 includes engaging a constraining latch 620 with a latchinterface 626 associated with the vertically-oriented backplane.Engaging a latch 620 with a latch interface 626, in some embodiments,secures the position of the mass storage device 602 relative to at leasta portion of the vertically-oriented backplane, including connector 612.As a result, engaging the latch 620 can secure the mass storage device602 in a coupled position relative to at least the connector 612.

In some embodiments, such as illustrated in at least FIG. 6-7, the latchinterface 626 can include a slot in a mounting plate 606, and the latch620 can include a latch rail 622 with a latch element 627 that, wheninserted through the latch interface 626, engages the latch 620 tosecure (“lock”) the mass storage device 602 in position. In someembodiments, and as illustrated by the directional arrows in at leastFIG. 7B, sliding the mass storage device 602 along the upper surfaces ofthe mounting plates 604, 606 can include sliding the latch element latchelement 627 along the upper surface of mounting plate 606 until thelatch element 626 encounters the latch interface latch element 627, atwhich point the latch element 627 inserts through the latch interface626 to engage the latch 620. The latch element 627, which can includeone or more protrusions, may be forced to insert through the encounteredlatch interface 626 based at least in part upon one or more springmechanisms associated with latch 620. It should be understood that aspring mechanism associated with latch 620 may include one or more typesof spring mechanisms and that the types of spring mechanisms that may beassociated with latch 620 should be understood to be encompassed by thetypes of spring mechanisms known in the relevant art.

In some embodiments, the latch 620 includes a spring mechanism and latchrail 622 coupled to a side of the mass storage device 602, and a latchtab 624 extending over at least one or more other sides of the massstorage device and encompassing at least a portion of the latch rail622. For example, as shown in FIG. 6-7, the latch rail 622 can include astrip of material that is coupled to a side of the mass storage device602 via coupling elements 608, 609. The latch rail 622 may include anangled portion that angles away from the surface of the mass storagedevice to which the latch rail 622 is coupled, with the latch element627 at the end of the angled portion of the latch rail 622 that caninsert into the latch interface 626 to engage the latch 620. The angledportion of the latch rail 622 can include a spring mechanism that forcesthe latch element 627 of the latch rail 622 away from the surface of themass storage device 602 in the absence of a substantially oppositeforce. For example, where the mass storage device 602 is resting on themounting plates 604, 606, and the latch element 627 of the latch rail622 is not aligned with the latch interface 626, as illustrated in FIG.7B, the upper surface of mounting plate 606 may force the angled portionof the latch element against the surface of the mass storage device 602.When the latch element 627 of the latch rail 622 is aligned with thelatch interface 626, also referred to as the latch rail 622 encounteringthe latch interface 626, the spring mechanism comprised in the angledportion of the latch rail 622 may force the latch element 627 into thelatch interface 626 to engage the latch 620.

As shown, the latch tab 624 may extend over one or more surfaces otherthan the surface to which the latch rail 622 is coupled via elements608, 609 and encompass a portion of the latch rail 622. The illustratedlatch tab 624 encompasses at least a portion of the angled portion ofthe latch rail 622, and pulling the latch tab 624 upwards, as shown inFIG. 7C, can pull the angled portion of the latch rail 622 towards thesurface of the mass storage device 602, overcoming the force of thespring mechanism and removing the latch element 627 from the latchinterface 626, thereby disengaging the latch 620.

As shown in FIGS. 6C and 7C, the mass storage device 602 can be“unlocked” from a secured position relative to at least a portion of thevertically-oriented backplane circuit board 610 based at least in partupon releasing the latch 620 from being engaged with the latch interface626. Releasing the constraining latch 620 may include manipulating alatch tab 624 encompassing a portion of the latch rail 622, wheremanipulating a position of the tab 624 manipulates the position of oneor more portions of the latch rail 622, including manipulating theposition of the latch element 627 relative to the latch interface 626.In certain embodiments, pulling the tab 624 in a direction away from thelatch interface 626 disengages the corresponding latch rail 622 from thelatch interface 626, releasing the latch 620. Where the latch interface626 is on a horizontally-oriented mounting plate 606, such asillustrated in FIGS. 6C and 7C and with particular reference to thedirectional arrows in FIG. 7C, releasing the latch 620 may includepulling upwards on a tab 624 to pull the latch element 627 upwards fromthe interface 626.

In some embodiments, the mass storage device 602 can be uninstalled froma vertically-oriented backplane based at least in part upon sliding themass storage device away 602 from the connector 612 along the uppersurfaces of the mounting plates 604, 606 to align the coupling elements608, 609 of the mass storage device 602 with a widest portion of thecorresponding keyhole slots 605, 607. The widest portion of the keyholeslots may have a size sufficient to accommodate the correspondingcoupling elements, while the narrower portions of the keyhole slots aresufficiently narrow to preclude the coupling elements from being removedfrom the mounting plate without sliding back to the widest portion.

In some embodiments, sliding the mass storage device 602 to aligncoupling elements 608, 609 with a widest portion of the correspondingkeyhole slots 605, 607 includes decoupling an electrical connector ofthe mass storage device 602 with the corresponding complementaryconnector 612, thereby decoupling the mass storage device 602 from thevertically-oriented backplane circuit board 610 of thevertically-oriented backplane. In some embodiments, the mass storagedevice 502 can be slid along the upper surfaces of mounting plates 604,606 upon the latch 620 being released, as discussed above. In someembodiments, upon aligning coupling elements 608, 609 with a widestportion of the corresponding keyhole slots 605, 607, the mass storagedevice 602 can be lifted away from the mounting plates 604, 606, wherethe coupling elements 608, 609 are lifted out of the correspondingkeyhole slots 605, 607, thereby uninstalling the mass storage devicefrom the vertically-oriented backplane.

FIG. 8A-B illustrate coupling a latch rail to a mass storage deviceaccording to some embodiments. As shown, latch rail 822 can be coupledto a proximate surface 815 of mass storage device 802 via one or morecoupling elements, including coupling element 809.

In some embodiments, including the illustrated embodiment, a couplingelement 809 includes one or more shoulder screws 810 and one or moreisolation damping grommets 810. As shown, in FIG. 8B, the latch rail 822can be coupled to mass storage device 802, via coupling element 809,such that the latch rail 822 is positioned between the mass storagedevice 802 and a grommet 811 and at least a portion of a shoulder screw810.

In some embodiments, the latch rail 822 can include a flush portion 823,also referred to herein as a “static rail”, that extends substantiallyin parallel with the proximate surface 815 of the coupled mass storagedevice 802, such that the static rail 823 lies substantially flush withthe mass storage device 802 surface 815 when the latch rail 822 iscoupled to the mass storage device, as shown in FIG. 8B. In someembodiments, the latch rail 822 includes a latch element 827, which caninclude one or more projection elements as shown in the illustratedembodiment, that can be inserted at least partially into a latchinterface to engage the latch element 827 and the coupled mass storagedevice 802 with the component in which the latch interface is located.The latch rail 822 may include an angled portion 824, which can include,as shown, one or more leaf spring elements, that angles away from thestatic rail 823. As a result, the leaf spring 824 may angle away fromthe proximate surface 815 of the mass storage device 802 to which thelatch rail 822 is coupled, as shown in FIG. 8B. As the latch element 827may be located on an end of the latch rail 822 that includes the leafspring 824, the leaf spring 824 may project the latch element 827 awayfrom the proximate surface 815 of the mass storage device 802.

In some embodiments, the leaf spring 824 comprises a spring mechanismthat resists one or more forces that may push the latch element 827towards the proximate surface 815 of the mass storage device 802. Forexample, as shown, the structure of the leaf spring 824 of the latchrail 822 may resist a force, normal to the proximate surface 815 of themass storage device 802, that pushes the latch element 827 towards theproximate surface 815 and forces the leaf spring 824 to liesubstantially flush with the proximate surface 815. Upon a release ofsuch a normal force, the leaf spring 824 may return substantially to theinitial angled configuration, such that the latch element 827 is pushedaway from the proximate surface 815. As a result, where the proximatesurface 815 is placed upon an upper surface of a mounting plate, themounting plate may exert a force on the latch element 827, pushing ittowards the proximate surface 815. The leaf spring 824 may resist theforce, such that when the latch element 827 is aligned with a latchinterface, and a force on the latch element 827 is released, the leafspring 824 may force the latch element 827 at least partially into thelatch interface, thereby engaging the latch.

FIG. 9 illustrates installing a mass storage device on a backplaneaccording to some embodiments. As shown in the illustrations, installinga mass storage device on a vertically-oriented backplane can includecoupling a retention bar to one or more portions of the mass storagedevice. The coupled retention bar, in some embodiments, stabilizes theposition of mass storage device relative to one or more other componentscoupled to the vertically-oriented backplane, including one or moreother mass storage devices installed to the same or anothervertically-oriented backplane, stabilizes the mass storage device fromside-shocks and potential collisions with the one or more othercomponents as a result, etc.

As shown in the illustrated embodiment, where one or more mass storagedevice 902 are coupled to one or more components of avertically-oriented backplane, including one or more mounting plates904, 906 and a vertically-oriented backplane circuit board 910, aretention bar 957 may be separate coupled to each of the mass storagedevices 902 via coupling of a coupling element 930 of each mass storagedevice 902 with a corresponding keyhole slot 907 of the retention bar957. Coupling the respective upper surface of each mass storage device902 the retention bar 957, where each keyhole slot 907 corresponding toeach mass storage device coupling element 930 is space a particulardistance apart, can stabilize a spacing of the upper surfaces of themass storage device 902 to a particular spacing distance 909 betweenadjacent devices 902. Such stabilized spacing can mitigate the risk ofcollisions between adjacent mass storage devices 902 caused byside-shocks, other impacts on the chassis to which the backplane iscoupled, etc.

FIG. 10 illustrates a data control module that includes a datacontroller and multiple mass storage devices coupled to one or morebackplane circuit boards according to some embodiments.

In various embodiments, a data storage system includes one or more datastorage modules that are accessed from, and controlled by, a datacontroller external to the data storage modules. In some embodiments,one or more data controllers are included in one or more data controlmodules that are separate from one or more data storage modules in adata storage system. In some embodiments, a data control module isincluded in a portion of a data storage module. For example, a datacontrol module may be mounted in an air plenum extending through atleast a portion of a data storage module. In some embodiments, a datacontrol module and one or more data storage modules coupled to the datacontrol module are included within a rack.

Various data control modules can be coupled with various data storagemodules. In some embodiments, one or more data control modules caninclude one or more data controller portions and one or more datastorage portions. For example, data control module 1000, which includesa chassis 1002 that at least partially encompasses a chassis interior ofmodule 1000, includes a data controller portion 1010 and a data storageportion 1030. The separate portions 1010, 1030 of the module 1000 may beseparated in the chassis interior of chassis 1002 based at least in parton a divider element 1020. In some embodiments, a divider 1020 is absentfrom the chassis interior.

Data controller portion 1010 can include one or more control circuitboard assemblies 1012, 1014 and power supply unit 1016. Control circuitboard assemblies 1012, 1014 and power supply unit 1016 may be coupled todata control module chassis 1002. Control circuit board assemblies 1012,1014 may access data on mass storage devices in one or more data storagemodules. In some embodiments, the separate circuit board assemblies1012, 1014 can access data on separate sets of mass storage devices,which may be in separate modules mounted on the rack.

In some embodiments, a data storage portion 1030 of a data controlmodule 1000 includes one or more mass storage devices 1034. The massstorage devices can store data, similarly to mass storage devices in oneor more data storage modules as discussed above with reference to atleast FIG. 1-9. As a result, the mass storage devices 1034 in datastorage portion 1030 can provide an additional storage capacity within arack to which module 1000 is coupled. Data control module 1000 maythereby optimize space usage within the rack interior, where a portionof the rack interior at a common elevation with the data control module1000 that would otherwise go unutilized by a data control module with adata control portion 1010 that extends through only a portion of thedepth of the rack at a given elevation is utilized to house additionalmass storage devices. For example, module 1000 may have a length thatextends substantially entirely through a depth of a rack from an inletend to an exhaust end of the rack. As a result, the rack interior spaceat a given elevation may be substantially occupied by the data controlmodule 1000 and is precluded from accommodating one or more variousother components in the rack interior at the given elevation, includingone or more rack-level power distribution units, air moving devicesexternal to module 1000, etc.

In some embodiments, the mass storage devices 1034 in data storageportion 1030 of module 1000 are installed on one or morevertically-oriented backplanes 1032 coupled to the chassis 1002, suchthat the mass storage devices 1034 are coupled in the chassis interiorin a primarily horizontal orientation. As shown, data storage portion1030 includes a vertically-oriented backplane 1032, to which multiplemass storage devices are coupled on opposite vertical faces of thebackplane, such that a largest dimension of each mass storage device isa length of the device that extends substantially perpendicular to theproximate vertical face of backplane 1032 to which the device iscoupled.

In some embodiments, backplane 1032 is coupled to chassis 1002 at anelevation in the chassis interior, so that one or more air passagesextend beneath the backplane 1032. Air supplied into the chassisinterior from an inlet end of module 1000, which may be proximate to anend of the data control portion 1010, may flow at least partiallybeneath backplane 1032, and separate portions of the airflow may besupplied upwards from the air passage in parallel flows along oppositevertical faces of the backplane 1032 and across one or more separatesets of mass storage devices 1034 to remove heat from one or more heatproducing components of the mass storage devices 1034.

Power supply unit 1016 may be coupled to one or more of control circuitboard assemblies 1012, 1014, backplane 1032, and mass storage devices1034. Power supply unit 1016 may supply power to control circuit boardassemblies 1012, 1014 backplane 1032, and mass storage devices 1034.

In some embodiments, data control module 1000 is about 1U in height. Invarious embodiments, a chassis 1002 for a data control module 1000 mayinclude, or be used in combination with, various structural elements andcomponents for support, mounting, and environmental protection of theelements of the module, such as enclosures, mounting plates, covers,panels, or mounting rails.

In certain embodiments, a data control module 1000 includes one or moreinternal air moving devices to induce an airflow through the interiorspace of module 1000. For example, in certain embodiments, a row of fansmay be provided along the rear edge of data control module 1000. Incertain embodiments, a computing unit may have no fans and/or no diskdrives.

In certain embodiments, a power supply may be external to the storage orcomputing module. For example, in certain embodiments, control circuitboard assemblies 1012, 1014 of data control module 1000 may receivepower from a power supply external to data control module chassis 1002(such as a rack-level power supply), and power supply unit 1016 may beomitted.

FIG. 11 illustrates a method of providing data storage that includesinstalling mass storage devices on two or more vertically-orientedbackplanes coupled to a chassis, according to some embodiments.

At 1102, two or more backplanes are coupled to a chassis, in a chassisinterior, in a primarily vertical orientation, as vertically-orientedbackplanes. One or more of the backplanes may include at least onevertically-oriented backplane circuit board that precludes airflowthrough the backplane circuit board between opposite vertical faces ofthe backplane, including opposite vertical faces one or more backplanecircuit boards in the backplane. A backplane may include twovertically-oriented backplane circuit boards extending substantially inparallel, where the backplane precludes airflow between oppositevertical faces of the substantially parallel backplane circuit boards.At 1104, one or more mass storage devices are coupled to one or more ofthe vertically-oriented backplanes. The mass storage devices mayinclude, for example, one or more hard disk drives. The mass storagedevices may be in a horizontal orientation. In one embodiment, datastorage and control are provided in a data storage module and datacontrol module similar to those described above relative to FIGS. 1-10.In certain embodiments, the backplanes are communicatively coupled toone another and at least one of the backplanes is communicativelycoupled to one or more data controllers. In some embodiments, thebackplanes are communicatively coupled to at least one expander deviceand the at least one expander device is communicatively coupled to oneor more data controllers. The one or more data controllers, which mayinclude one or more data control modules, may be external to the chassisto which the backplanes are coupled. In certain embodiments, couplingthe vertically oriented backplanes to the chassis and one or more massstorage devices to the backplanes at least partially established one ormore air passages through at least a portion of the chassis interior,including one or more inlet air plenums extending from the inlet end ofthe chassis towards the exhaust end beneath at least one of thebackplanes, one or more exhaust air plenums extending from the inlet endof the chassis towards the exhaust end above at least one of thebackplanes, and one or more substantially parallel air passagesextending from the inlet air plenum to the exhaust air plenum in thechassis interior and at least partially bounded by at least one verticalface of one of the vertically-oriented backplanes.

At 1106, the chassis is mounted in a rack. The chassis may be coupled tothe rack via one or more mounting elements on the chassis or rack. Thechassis may rest on one or more mounting elements of the rack, includingone or more chassis support rails extending at least partially inparallel along a depth of the rack in parallel with the length of thechassis from the inlet end towards the exhaust end, one or more shelfmodules, etc.

At 1108, airflow is induced through the chassis interior. Such a“chassis airflow,” which may include some or all of an inlet airflowthrough an inlet air plenum, an exhaust airflow through an exhaust airplenum, and one or more substantially parallel airflows between theplenums in the chassis interior and at least partially bounded by atleast one vertical face of one of the vertically-oriented backplanes.The chassis airflow may be induced based at least in part upon operationof one or more air moving devices. The air moving devices may be coupledto the chassis at least partially in the chassis interior. The airmoving devices may be mounted on the rack in proximity to one or moreends of the chassis. In certain embodiments, an air moving deviceinduces a chassis airflow in a chassis based at least in part uponmoving air to reduce air pressure in at least a portion of a chassisinterior relative to an ambient air pressure, thereby creating apressure gradient between the portion of the chassis interior and theambient environment that drives airflow into the portion of the chassisinterior.

At 1110, some or all of the mass storage devices on the backplanes maybe placed into operation. For example, the mass storage devices mayprovide storage capacity in a data center.

At 1112, one or more of the air moving devices are adjusted inorientation. Orientation of an air moving device may be adjusted basedat least in part upon operation of one or more actuator devices. Theactuator devices may operate to adjust the air moving device orientationto one or more particular orientations to direct the flow of exhaust airfrom the air moving device in a particular direction. The actuatordevices may operate to adjust the air moving device orientation to oneor more particular orientations based at least on one or more commandsignals received at the actuator devices from one or more controllerdevices. The controller devices may include one or more portions of adata control module.

At 1114, data from one or more of the mass storage devices is accessed.Data may be accessed by one or more data control modules communicativelycoupled to the mass storage devices via one or more backplanes to whichthe mass storage devices are electrically coupled.

Upon failure of a mass storage device in a module, the module may beremoved or withdrawn from its installed position in a rack. The failedmass storage device may be removed and replaced by way of the top of themodule.

FIG. 12 illustrates a method of providing data storage that includesinstalling mass storage devices on a backplane, according to someembodiments.

At 1200, at least a portion of a mass storage device is inserted intoone or more keyhole slots of a mounting plate coupled to a chassis of adata storage module. The mounting plate may be oriented in a primarilyhorizontal orientation and may be a horizontally-oriented component of avertically-oriented backplane, where the mounting plate may be adjacentto a vertically-oriented backplane circuit board. The mass storagedevice may include one or more interface elements, including one or moreisolation damping shoulder screws, that can be inserted into a keyholeslot on the mounting plate. The mass storage device may include aconstraining latch that can couple with a latch interface on one or morecomponents of a vertically-oriented backplane, including a mountingplate, a vertically-oriented backplane circuit board, etc. The massstorage device may include an electrical connector. In certainembodiments, lowering the mass storage device into a keyhole slot on amounting plate substantially aligns an electrical connector on aparticular side of the mass storage device with a complementaryelectrical connector on a vertical face of a vertically-orientedbackplane circuit board. In some embodiments, inserting a portion of amass storage device into a portion of a mounting plate is comprised inmounting the mass storage device on the mounting plate.

At 1202, the mass storage device is slid towards an electrical connectoron a vertically-oriented backplane circuit board to couple acomplementary electrical connector on the mass storage device with theelectrical connector, thereby electrically coupling the mass storagedevice to the vertically-oriented backplane circuit board via thecomplementary coupled connectors. In certain embodiments, sliding themass storage device towards the electrical connector includes slidingthe one or more interface elements of the mass storage device through anarrowing portion of the keyhole slot to secure the mass storage deviceto the mounting plate via the interface elements.

At 1204, the constraining latch is engaged to couple with a latchinterface on one or more components of a vertically-oriented backplane,including a mounting plate, a vertically-oriented backplane circuitboard, etc. In certain embodiments, the latch is engaged based at leastin part upon the mass storage device being slid a sufficient thresholddistance towards the electrical connector on the vertically-orientedbackplane circuit board such that a latch element of the latchencounters a latch interface and engages with the latch interface toengage the latch. In certain embodiments, the engaged latch precludesthe mass storage device from being decoupled from the electricalconnector on the vertically-oriented backplane circuit board throughsliding force exerted on the mass storage device alone.

At 1206, a retention bar is coupled to at least the mass storage device.The retention bar may be placed in contact with an upper surface of themass storage device and coupled to the mass storage device via one ormore coupling elements, including one or more isolation damping shoulderscrews, to secure the position of the retention bar relative to the massstorage device. In certain embodiments, the retention bar is coupled toadditional mass storage devices via additional coupling elements, wherethe retention bar ensures that the mass storage devices are spaced inparticular relative positions to mitigate risk of collisions involvingmass storage devices, side shock, etc. In some embodiments, coupling aretention bar to at least the mass storage device is optional.

FIG. 13 illustrates a method of uninstalling mass storage devices from abackplane, according to some embodiments.

At 1300, a retention bar is decoupled from at least the mass storagedevice. Decoupling the retention bar may include removing one or morecoupling elements coupling the retention bar to the mass storage device,including one or more shoulder screws. In certain embodiments, theretention bar is decoupled from multiple mass storage devicessimultaneously. In some embodiments, including where a retention bar isnot coupled to the mass storage device, decoupling the retention bar isomitted.

At 1302, the constraining latch is released. Releasing the constraininglatch may include manipulating a tab coupled to the latch element, wheremanipulating a position of the tab manipulates the position of the latchelement. In certain embodiments, pulling the tab in a direction awayfrom the latch interface decouples the corresponding latch element fromthe latch interface, releasing the latch. Where the latch interface ison a horizontally-oriented mounting plate, releasing the latch mayinclude pulling upwards on a tab to pull the latch element upwards fromthe interface.

At 1304, the mass storage device is slid away from the electricalconnector on the vertically-oriented backplane circuit board to decouplethe complementary electrical connector on the mass storage device withthe electrical connector, thereby electrically decoupling the massstorage device from the vertically-oriented backplane circuit board. Incertain embodiments, sliding the mass storage device away from theelectrical connector includes sliding the one or more interface elementsof the mass storage device through a widening portion of the keyholeslot.

At 1306, the mass storage device is removed from one or more keyholeslots of the mounting plate to decouple the mass storage device from themounting plate. In certain embodiments, where the mass storage device isslid into a particular position relative to the keyhole slots, removingthe mass storage device includes lifting the mass storage device awayfrom the mounting plate, where the interface elements of the massstorage device are lifted out of the keyhole slots.

In some embodiments, mass storage devices in a data storage module arestandard, off-the-shelf hard disk drives. Examples of suitable hard diskdrive form factors may include 3.5″, 5.25″, and 2.5″. In one embodiment,a standard 3.5″ hard disk drive is installed such that the installedlength of the hard disk drive extending substantially perpendicular tothe vertically-oriented backplane circuit board to which the hard diskdrive is coupled is the largest dimension.

For clarity, modules in many of the figures herein have been shown witha simple box outline around functional components. In variousembodiments, a module or a chassis for a module may include anenclosure, a tray, a mounting plate, a combination thereof, as well asvarious other structural elements.

Although in the embodiments described above, some of the data storagemodules have been described as being 3U in height, modules may invarious embodiments be 2U, 4U, 5U, 6U or any other height or dimensions.

The various methods as illustrated in the Figures and described hereinrepresent example embodiments of methods. The methods may be implementedin software, hardware, or a combination thereof. The order of method maybe changed, and various elements may be added, reordered, combined,omitted, modified, etc.

Although the embodiments above have been described in considerabledetail, numerous variations and modifications will become apparent tothose skilled in the art once the above disclosure is fully appreciated.It is intended that the following claims be interpreted to embrace allsuch variations and modifications.

What is claimed is:
 1. A system for storing data, comprising: a rack;and one or more data storage modules mounted on the rack, at least oneof the data storage modules comprising: a chassis, having an inlet endand an exhaust end, that at least partially encompasses a chassisinterior; two or more vertically-oriented backplanes coupled to thechassis in the chassis interior, wherein each of the vertically-orientedbackplanes is configured to preclude airflow through the respectivevertically-oriented backplane between opposite vertical faces of therespective vertically-oriented backplane; two or more mass storagedevices installed on a vertically-oriented backplane of the two or morevertically-oriented backplanes, wherein: the vertically-orientedbackplane includes: a first vertical face; and a second vertical faceparallel to the first vertical face and facing opposite the firstvertical face in a direction orthogonal to a plane defined by the firstvertical face; a first mass storage device of the two or more massstorage devices is installed on the first vertical face of thevertically-oriented backplane; and a second mass storage device of thetwo or more mass storage devices is installed on the second verticalface of the vertically-oriented backplane; and one or more air passagesextending beneath at least the vertically-oriented backplane in thechassis interior from the inlet end towards the exhaust end, wherein theone or more air passages are each configured to supply anupwards-directed airflow along at least one of the first vertical faceor the second vertical face of the vertically-oriented backplane toremove heat from at least one heat producing component of one or moremass storage devices installed on the at least one of the first verticalface or the second vertical face of the vertically-oriented backplane.2. The system of claim 1, wherein: the two or more vertically-orientedbackplanes are coupled to the chassis in a staggered configuration, suchthat a particular one of the backplanes that is coupled to the chassisproximate to the inlet end is elevated relative to another one of thebackplanes that is coupled to the chassis proximate to the exhaust end;the one or more air passages are configured to supply theupwards-directed airflow with a laterally-directed airflow through theone or more air passages from the inlet end of the chassis; and the oneor more air passages are further configured to progressively impede thelaterally-directed airflow through the one or more air passages from theinlet end towards the exhaust end, wherein to progressively impede thelaterally-direct airflow, the one or more air passages are configured toprogressively narrow from the inlet end of the chassis towards theexhaust end of the chassis, based at least in part upon the staggeredconfiguration of the two or more vertically-oriented backplanes.
 3. Thesystem of claim 1, wherein: the at least one of the data storage modulescomprises one or more air moving devices coupled to the exhaust end ofthe chassis and configured to induce at least the upwards-directedairflow; wherein, to induce the upwards-directed airflow, the one ormore air moving devices are configured to induce an air pressuredifference between at least a portion of the chassis interior and anexternal environment, such that the upward-directed airflow is inducedbased at least in part upon the induced air pressure difference.
 4. Thesystem of claim 1, comprising: at least one data control module mountedon the rack, wherein the at least one data control module is configuredto access one or more of the mass storage devices in the at least one ofthe data storage modules; and at least one additional data storagemodule mounted on the rack at a common elevation with the at least onedata control module in the rack, wherein the at least one additionaldata storage module comprises at least one vertically-oriented backplaneconfigured to couple with at least one mass storage device on each ofopposite vertical faces of the at least one vertically-orientedbackplane.
 5. A data storage module, comprising: a chassis, having aninlet end and an exhaust end, that at least partially encompasses achassis interior; two or more vertically-oriented backplanes coupled tothe chassis, wherein each of the vertically-oriented backplanes isconfigured to preclude airflow through the respectivevertically-oriented backplane between opposite vertical faces of therespective vertically-oriented backplane and is further configured tocouple with at least one of two or more mass storage devices on at leastone vertical face of the opposite vertical faces of the respectivevertically-oriented backplane, and a vertically-oriented backplane ofthe two or more vertically-oriented backplanes is configured toseparately couple with at least two separate mass storage devices,wherein: the vertically-oriented backplane includes: a first verticalface; and a second vertical face parallel to the first vertical face andfacing opposite the first vertical face in a direction orthogonal to aplane defined by the first vertical face; a first mass storage device ofthe at least two separate mass storage devices is configured to couplewith the vertically-oriented backplane on the first vertical face of thevertically-oriented backplane; and a second mass storage device of theat least two separate mass storage devices is configured to couple withthe vertically-oriented backplane on the second vertical face of thevertically-oriented backplane; and one or more air passages extendingbeneath at least at least one vertically-oriented backplane of the twoor more vertically-oriented backplanes in the chassis interior from theinlet end towards the exhaust end, wherein the one or more air passagesare each configured to supply an upwards-directed airflow along at leastone of the opposite vertical faces of the at least onevertically-oriented backplane to remove heat from at least one heatproducing component of at least one mass storage device coupled to theat least one of the opposite vertical faces of the at least onevertically-oriented backplane.
 6. The data storage module of claim 5,wherein: the two or more vertically-oriented backplanes are coupled tothe chassis in a staggered configuration, such that a particular one ofthe backplanes that is coupled to the chassis proximate to the inlet endis elevated relative to another one of the backplanes that is coupled tothe chassis proximate to the exhaust end; and the one or more airpassages are configured to direct a laterally-directed airflow throughthe one or more air passages from the inlet end of the chassis to supplythe upwards-directed airflow.
 7. The data storage module of claim 6,wherein: the one or more air passages are further configured toprogressively impede the laterally-directed airflow through the one ormore air passages from the inlet end towards the exhaust end, wherein toprogressively impede the laterally-directed airflow, the one or more airpassages are configured to progressively narrow from the inlet end ofthe chassis towards the exhaust end of the chassis, based at least inpart upon the staggered configuration of the two or morevertically-oriented backplanes.
 8. The data storage module of claim 5,comprising: one or more exhaust air passages extending above at leastone vertically-oriented backplane of the two or more vertically-orientedbackplanes in the chassis interior from the inlet end towards theexhaust end, wherein the one or more exhaust air passages are eachconfigured to supply an exhaust airflow, of air that has removed heatfrom at least one of the mass storage devices, to an externalenvironment via the exhaust end of the interior space.
 9. The datastorage module of claim 8, comprising: one or more air moving devicescoupled to one of the inlet end of the chassis or the exhaust end of thechassis and configured to provide discrete cooling of each of the two ormore mass storage devices; wherein, to provide discrete cooling of eachof the two or more mass storage devices, the one or more air movingdevices are configured to induce a chassis airflow through the chassisinterior from the inlet end of the chassis to the exhaust end of thechassis; and wherein the chassis airflow comprises a laterally-directedairflow through the one or more air passages, the upwards-directedairflow along at least one of the opposite vertical faces of the atleast one vertically-oriented backplane, and the exhaust airflow. 10.The data storage module of claim 9, wherein: the one or more air movingdevices are comprised in a discrete cooling module that is indirectlycoupled to the chassis via directly coupling with a rack to which thechassis is coupled.
 11. The data storage module of claim 5, comprising:one or more data control modules mounted at least partially in the oneor more air passages extending beneath at least the at least onevertically-oriented backplane, wherein the one or more data controlmodules are configured to access one or more of the mass storage devicescoupled to at least one of the two or more vertically-orientedbackplanes.
 12. The data storage module of claim 9, wherein: the one ormore air moving devices each comprise an actuator configured to adjustan orientation of the one or more air moving devices based at least inpart upon one or more characteristics associated with the chassisairflow.
 13. The data storage module of claim 5, wherein: the chassis isconfigured to accommodate a plurality of backplanes, each of theplurality of backplanes configured to mount one or more mass storagedevices, in a full-depth configuration in the chassis interior; and toaccommodate a plurality of backplanes in a full-depth configuration, thechassis is configured to: extend, from the inlet end of the chassis tothe exhaust end of the chassis, along an entire depth of an interior ofa rack to which the chassis is coupled from an inlet end of the rack toan exhaust end of the rack, such that a power distribution unit isexcluded from coupling to the rack to extend into the inlet end of therack at a common elevation with the chassis in the rack.
 14. A method ofproviding data storage, comprising: coupling two or morevertically-oriented backplanes to a chassis in a chassis interior atleast partially encompassed by the chassis, wherein avertically-oriented backplane of the two or more vertically-orientedbackplanes is configured to: separately couple with at least twoseparate mass storage devices, wherein: the vertically-orientedbackplane includes: a first vertical face; and a second vertical faceparallel to the first vertical face and facing opposite the firstvertical face in a direction orthogonal to a plane defined by the firstvertical face; a first mass storage device of the at least two separatemass storage devices is configured to couple with thevertically-oriented backplane on the first vertical face of thevertically-oriented backplane; and a second mass storage device of theat least two separate mass storage devices is configured to couple withthe vertically-oriented backplane on the second vertical face of thevertically-oriented backplane; and preclude airflow through therespective vertically-oriented backplane between opposite vertical facesof the respective vertically-oriented backplane, such that each verticalface of the respective vertically-oriented backplane is configured todirect an upwards-directed airflow along the vertical face to removeheat from at least one heat producing component of at least one massstorage device coupled to the vertical face.
 15. The method of claim 14,wherein: coupling the two or more vertically-oriented backplanes to achassis in a chassis interior at least partially encompassed by thechassis comprises: coupling a particular one of the vertically-orientedbackplanes to the chassis, proximate to the inlet end, at a particularelevation in the chassis interior; and coupling another one of thevertically-oriented backplanes to the chassis, proximate to the exhaustend, at another elevation in the chassis interior; wherein theparticular elevation of the particular one of the vertically-orientedbackplanes is at least partially greater than the other elevation of theother one of the vertically-oriented backplanes; and wherein a lowerportion, extending below a lowest elevation of the particular one of thevertically-oriented backplanes, of at least one vertical face of theother one of the vertically-oriented backplanes is configured to directat least a portion of air flowing beneath a lowest elevation of theparticular one of the vertically-oriented backplanes along the at leastone vertical face in at least one upwards-directed airflow.
 16. Themethod of claim 15, wherein: coupling the two or morevertically-oriented backplanes to a chassis in a chassis interior atleast partially encompassed by the chassis further comprises: couplingat least the particular one of the vertically-oriented backplanes andthe other one of the vertically-oriented backplanes to establish alaterally-directed progressively-narrowing air passage extending beneathat least the particular one of the vertically-oriented backplanes froman inlet end of the chassis towards an exhaust end of the chassis;wherein the progressively-narrowing air passage is configured toprogressively impede a laterally-directed airflow through theprogressively-narrowing air passage from the inlet end towards theexhaust end.
 17. The method of claim 14, comprising: coupling one ormore air moving devices, configured to provide discrete cooling of heatproducing components within the chassis interior, to one of an inlet endof the chassis or an exhaust end of the chassis; wherein, to providediscrete cooling of heat producing components within the chassisinterior, the one or more air moving devices are configured to induce achassis airflow through the chassis interior from an inlet end of thechassis to an exhaust end of the chassis; wherein the chassis airflowcomprises at least one of the upwards-directed airflows along at leastone vertical face of at least one of the two or more vertically-orientedbackplanes.
 18. The method of claim 17, wherein: the one or more airmoving devices each comprise an actuator configured to adjust anorientation of the one or more air moving devices based at least in partupon one or more characteristics associated with the chassis airflow.19. The data storage module of claim 5, wherein: the at least twoseparate mass storage devices are configured to be horizontally orientedwhen the at least two separate mass storage devices are coupled to thevertically-oriented backplane.